Mec Company Ltd.

Masami Tsutae

Kiyoto Tai

Keisuke Joko

Tsuyoshi Amatani

Yoichi Sengoku

Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25&#xb0; C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25&#xb0; C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.

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Amagasaki, Japan

Masami Tsutae