Kyocera Corporation

Masami Terasawa

Hiroshi Fujinaka

Jun Tanaka

Yoshinobu Kunitomo

Hitoshi Oikawa

Disclosed is a package for housing semiconductor elements, which comprises an insulating substrate having in the interior thereof a cavity for attaching and housing semiconductor elements and a lid member covering said cavity, wherein the insulating substrate is composed of a mullite sintered body comprising 70 to 95% by weight of mullite and 5 to 30% by weight, as the total content, of silica (SiO.sub.2) and at least one member selected from the group consisting of magnesia (MgO) and calcia (CaO), and SiO.sub.2, MgO and CaO are present in the following composition expressed by % by weight based on the three components:

Package for housing semiconductor elements

A paste of a glazing composition is coated on the entire surface of a ceramic substrate having a metallized metal portion, and the paste-coated ceramic substrate is sintered in a reducing atmosphere, and a glazing layer is formed on the entire surface of the metallized metal portion by utilizing the repellency of the melt of the glazing composition to the metallized metal portion. A glazing composition comprising SiO.sub.2, B.sub.2 O.sub.3, BaO, Al.sub.2 O.sub.3 and an alkali metal oxide or a glazing composition comprising SiO.sub.2, BaO, Al.sub.2 O.sub.3, CaO and MgO or SrO is used. An acrylic resin syrup, especially an isobutyl methacrylate resin syrup, is used as a binder of a coating paste for forming a glazing layer.

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Kokubu, Japan

Masami Terasawa