Asahi Glass Company, Limited

Agc Inc.

Masami Suzuki

Wataru Kasai

Seigo Kotera

Ken Moriwaki

Hideharu Hosoya

To provide a film excellent in breakage resistance and uniform stretchability, and a method for its production. The film is a single-layer film characterized in that it is made of a blend resin of two kinds of resins both belonging to any one of ETFE, PFA, FEP, ECTFE and PMP, wherein the melt flow rate of the film is at least 6 g/10 min. and less than 20 g/10 min., and &#x3b1; of the film as measured by a prescribed measurement method is at least 0.99.

Film and method for its production

To provide a mold release film which has excellent mold releasing property and is capable of reducing contamination of a mold in a sealing step; a process for producing the mold release film; and a process for producing a semiconductor package by using the mold release film. The mold release filmis a mold release film to be disposed on a surface of a mold which is to be in contact with a curable resin, in the production of a semiconductor package by disposing a semiconductor element in the mold, and sealing it with the curable resin to form a resin sealed portion. This mold release filmcomprises a resin-side mold release layerto be in contact with the curable resin at the time of forming the resin sealed portion, and a gas barrier layer. The gas barrier layercontains at least one polymer (I) selected from the group consisting of a polymer having vinyl alcohol units and a polymer having vinylidene chloride units, and the thickness of the gas barrier layeris from 0.1 to 5 &#x3bc;m.

Mold release film, process for its production, and process for producing semiconductor package

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A filmwhich comprises a substrateand an adhesive layer, wherein the storage elastic modulus at 180&#xb0; C. of the substrateis from 10 to 100 MPa, and the adhesive layeris a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles Mof hydroxy groups and the number of moles Mof carboxy groups, derived from the acrylic polymer, and the number of moles Mof isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

Film, method for its production, and method for producing semiconductor element using the film

A mold release film, which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and forming a resin-encapsulation portion excellent in adhesion to an ink layer, is provided. The mold release film is disposed on a cavity surface of a mold, in which a semiconductor element is disposed and encapsulated with a curable resin to form a resin-encapsulation portion. The mold release film has a first surface in contact with the curable resin when the resin-encapsulation portion is formed, and a second surface in contact with the cavity surface. At least the first surface is made of a fluororesin. The mold release film has an F/Al ratio of from 0.2 to 4, or an F/(C+F+O) ratio of from 0.1 to 0.3. A process for producing a semiconductor package using the mold release film is also provided.

Mold release film and process for producing semiconductor package

A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least one of the first surface and the second surface has irregularities formed thereon, and the surface having irregularities formed thereon, has an arithmetic mean roughness (Ra) of from 1.3 to 2.5 &#x3bc;m and a peak count (RPc) of from 80 to 200; and a process for producing a semiconductor package by using the mold release film.

Growing community of inventors

Chiyoda-ku, Japan

Masami Suzuki