Pioneer Corporation

Sony Corporation

Fuji Photo Film Company, Limited

Oki Electric Industry Co., Ltd.

Toshiba Battery Co., Ltd.

Sony Semiconductor Solutions Corporation

Fujikura Limited

Asm Japan K.k.

Pioneer Smart Sensing Innovations Corporation

Zeon Kasel Co., Ltd.

Masami Suzuki

Takehiko Shioda

Osamu Yamazaki

Yasuteru Kodama

Manabu Nohara

Takayuki Akimoto

Masahiro Okamura

Masaaki Fujiyama

Yoshikazu Takahashi

Yoshihito Higashitsutsumi

Masaru Kimura

Hiroto Inoue

Katsunori Arakawa

Satoshi Odagawa

Muneto Hayami

Kazuo Udagawa

Nobutaka Yamaguchi

Yuji Takaoka

Hirotaka Sakai

Yoshimichi Harada

Yoshihiro Nabe

Kazuo Iizuka

Naomi Ishihara

Satoshi Hirahara

Kiyoto Yoda

Masataka Shikota

Yasuyuki Yamada

Masami Sato

Tatsuo Suemasu

Hideyuki Wada

Masanobu Saruta

Hiroyuki Yamada

Yukihiro Mori

Akihiro Tozaki

Hitoshi Kaneko

Katsumi Ryoke

Tohru Kanegae

Eiichi Tadokoro

Takashi Yoneyama

Naoto Tsuji

Masaaki Takizawa

Masahiro Katsumura

Kiyoshi Takei

Hideaki Kosha

Masayuki Kageyama

Sugihiko Tada

Takashi Iwasaki

Hiroshi Seino

Kenji Mito

Fumihata Yamamoto

Satoshi Shimizu

Chiaki Sakai

Yasuyuki Ito

Teruo Baba

Yoichiro Fujinaga

Daisuke Chino

Masayuki Nagao

Masahiro Utsumi

Masahiro Kato

Isaya Kitamura

Tominori Yoshida

Hideyuki Kuroda

Tasuku Ogami

Koji Kano

Manahiko Hashiotani

Katsumi Sugimoto

Mitsuhiro Akano

The controllerof the in-vehicle deviceacquires point cloud data outputted by a lidar. Then, the controllergenerates processed point cloud data obtained by down-sampling the point cloud data. The controllermatches the processed point cloud data with voxel data VD which represents a position of an object with respect to each voxel that is a unit area and thereby associates a measurement point of the processed point cloud data with the each voxel. Then, the controllerchanges the size of the subsequent down-sampling based on the associated measurement points number Nc which is the number of measurement points associated with the each voxel among the measurement points of the processed point cloud data.

Information processing device, control method, program, and storage medium

Provided with a semiconductor apparatus which is able to be miniaturized and is provided with a Peltier element. The semiconductor apparatus is provided with a semiconductor substrate and the Peltier element which is disposed facing the semiconductor substrate. The Peltier element has a first substrate and a thermoelectric semiconductor which is disposed between the first substrate and the semiconductor substrate. The semiconductor substrate has a first electrode provided on a surface side facing the first substrate. The first substrate has a second electrode provided on a surface side facing the semiconductor substrate. The first electrodes and the second electrodes are each connected to the thermoelectric semiconductor.

Semiconductor apparatus including Peltier element

Electromagnetic noise is inhibited in a semiconductor package provided with rewiring. The semiconductor package includes a semiconductor integrated circuit, wiring, and a ferromagnetic material. In addition, in the semiconductor package including the semiconductor integrated circuit, the wiring, and the ferromagnetic material, the wiring connects the semiconductor integrated circuit to a predetermined external terminal. Further, in the semiconductor package including the semiconductor integrated circuit, the wiring, and the ferromagnetic material, the ferromagnetic material is provided between the wiring and the semiconductor integrated circuit.

Semiconductor package and method for manufacturing semiconductor package

An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Image pickup apparatus and camera module

Provided is an estimation device capable of estimating a current position with a high degree of accuracy. A driving support system includes: a vehicle mounted devicethat is mounted on a vehicle and performs a control concerning vehicle driving support; a LIDAR; a gyroscope sensor; and a vehicle speed sensor. The vehicle mounted deviceacquires, from the LIDAR, a measurement value zindicating a positional relationship between a reference landmark Lk of an index k and the own vehicle. The vehicle mounted devicecalculates a post estimated value x{circumflex over (&#x2003;)}by correcting a prior estimated value xestimated, on the basis of the measurement value zand a position vector mof the reference landmark Lk included in a map DB, from a moving speed measured by the vehicle speed sensorand an angular rate measured by the gyroscope sensor

Estimation device, control method, program and storage medium

A impedance matching apparatus () is provided with: a matching circuit () having a plurality of variable reactance elements; an incident signal/reflected signal extracting circuit () configured to extract an incident signal and a reflected signal; an estimating device () configured to estimate input impedance of a transmitting antenna () on the basis of the extracted incident signal and the extracted reflected signal; and a setting device () configured to set a value associated with one part of the plurality of variable reactance elements such that output impedance of a power supply () theoretically matches the input impedance on the basis of the estimated input impedance, and then adjust a value associated with at least one of the plurality of variable reactance elements according to the extracted reflected signal.

Impedance matching apparatus and method, and computer program

In an impedance matching device between a power transmission circuit and a power transmission antenna, a storage unit stores tables associated with a load value, each storing control values of a coupling coefficient between the power transmission and reception antennae. A selection unit selects a table corresponding to the load value estimated by the load value estimation unit. An adjustment direction determination unit determines the direction of a position for reading out one of the control values from the selected table. A readout position determination unit determines the position for reading out the control value from the selected table based on the direction and a predetermined step width for shifting the position for reading out the control value. A circuit selection unit electrically connects a matching circuit or the through circuit. A control value output unit outputs the control value at the determined position to the selected circuit.

Impedance matching device and control method

In an impedance matching device, a storage unit stores a control value representing a load value and a value equivalent to input impedance in advance. The control value identifies inductance and capacitance values matching a predetermined impedance value by use of either a first or second matching circuit. An impedance estimation unit estimates input impedance of the power transmission antenna. The load value estimation unit estimates load value of a circuit connected to a power reception antenna and consuming transmitted electric power. A circuit selection unit electrically connects the first matching circuit, the second matching circuit, or a through circuit per the load value and the input impedance equivalent value. A control value output unit reads out the control value stored in the storage unit based on the load value and the input impedance equivalent value, and outputs the control value to the circuit selected by the circuit selection unit.

Impedance matching device, power reception-side device, and control method

An optical sensor is described herein. By way of example, the optical sensor comprises a first light filter on a first light-receiving surface of an image sensor, and a second light filter on a second light-receiving surface of the image sensor. The second light-receiving surface is on an opposite side of the image sensor from the first light-receiving surface. The characteristics of the first light filter are different than characteristics of the second light filter.

Double-sided optical sensor for a camera module

A semiconductor apparatus having a through-hole interconnection in a semiconductor substrate. An insulating layer is formed on the semiconductor substrate. A via hole is formed through the semiconductor substrate and the insulating layer. The through-hole interconnection has another insulating layer formed in the via hole and a conductive layer formed thereon. The insulating layer formed in the via hole is formed such as to substantially planarize an inner surface of the via hole.

Semiconductor apparatus having a through-hole interconnection

Growing community of inventors

Kanagawa, Japan

Masami Suzuki