Taiyo Yuden Co., Ltd.

Masami Seto

Ichiro Yokoyama

Noriyuki Mabuchi

Yoshikazu Maruyama

Ikuo Kakiuchi

Masataka Kohara

Tomoyuki Oyoshi

Keiichi Nozawa

Masakazu Okazaki

Chikako Yoshida

An electronic component includes: an insulator part () of rectangular solid shape; a coil element () provided inside the insulator part (); bottom electrodes () provided on a bottom face () of the insulator part () and electrically connected to the coil element (); a plating layer () provided in a manner overlapping each bottom electrode () so that its end () on the bottom face () is away from the end () of the bottom electrode (); a plating layer () which is arranged between the bottom electrode () and the plating layer () and overlaps the bottom electrode (), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (); and an insulation layer () provided on the bottom face () in a manner covering the end () of the bottom electrode ().

Electronic component and electronic apparatus

In an embodiment, an electronic component includes: an insulator partof rectangular solid shape; a coil elementprovided inside the insulator part; bottom electrodesprovided on a bottom faceof the insulator partand electrically connected to the coil element; a plating layerprovided in a manner overlapping each bottom electrodeso that its endon the bottom faceis away from the endof the bottom electrode; and a plating layerwhich is arranged between the bottom electrodeand the plating layerand overlaps the bottom electrode, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer. The electronic component can suppress generation of cracking in the insulator part.

Electronic component, electronic apparatus, and method for manufacturing electronic component

Growing community of inventors

Hidaka-gun, Japan

Masami Seto