Ricoh Company, Ltd.

Masami Seto

Toshihiko Taneda

Masayuki Fujishima

Kikuo Saka

Toshiya Yamaguchi

A light deflector includes a movable portion including a reflector; multiple drive beams supporting the movable portion to allow the movable portion to be oscillatable; at least one supporting part supporting the multiple drive beams, the at least one supporting part including a first connecting portion and a second connecting portion different from the first connecting portion; and a stopper having one end connected to the first connecting portion and the other end connected to the second connecting portion on the at least one supporting part to be contactable with and straddle the multiple drive beams.

Light deflector, analyzer, resin identification system, and distance measurement device

An optical device and a light-source device. The optical device includes a first substrate having a first plane and elements, and a second substrate having a second face that faces the first plane. The elements are disposed on the first substrate to emit or receive light in a direction intersecting with the first plane. The second substrate includes lenses disposed to correspond to the elements, and the second substrate extends in a first direction parallel to the second face to contact the first plane. The second substrate has a joint used to determine spacing between the first substrate and the second substrate, and the joint contacts the first substrate with an area smaller than a maximum size of cross-sectional area parallel to the second face of the joint. The light-source device includes the optical device and a driver to drive the optical device.

Optical device, light-source device, detector, and electronic device

An atmosphere sensor includes a detecting element configured to detect external atmospheric characteristics of the atmosphere sensor. The atmosphere sensor includes inside a case having an opening, to contain the detecting element; and a moisture permeable film located on the opening to pass external water vapor of the atmosphere sensor. The moisture permeable film is bonded to the case by a welding method.

Atmosphere sensor and method of producing the same, and method of producing printed matter

A sheet basis weight sensing device for an image forming apparatus includes a sensor to detect heat conductivity of an ambient gas on a surface of a sheet on which the droplet is deposited or the surface opposite the sheet before and after the droplet is deposited; and a controller configured to: measure a time it takes the heat conductivity after the droplet is deposited to change by a predetermined ratio compared to the heat conductivity before deposition of the droplet; and obtain the sheet basis weight based on a relation between the time and the basis weight. The sheet basis weight sensing device further includes a memory to store a first table and a second table, and an image forming condition controller to set an appropriate image forming condition with reference to the second table.

Paper basis weight sensing device and method, and image forming apparatus incorporating same

A semiconductor sensor production method includes the steps of (A) forming a first etching mask layer on a support part segment of a backside semiconductor layer, except on a portion of the support part segment which portion is along edges of the support part segment; (B) forming a second etching mask layer on the support part segment and a proof mass part segment of the backside semiconductor layer; (C) selectively removing segments of the back side semiconductor layer between the proof mass part segment and the support part segment by performing etching; (D) making the proof mass part segment of the back side semiconductor layer thinner than the support part segment of the back side semiconductor layer by performing etching; and (E) removing the first etching mask layer by using a wet etching method.

Semiconductor sensor production method and semiconductor sensor

A disclosed semiconductor sensor includes a proof-mass, a frame disposed around the proof-mass and including at least a silicon layer, a beam for supporting the proof-mass, the beam being disposed at a first surface side of the frame between the proof-mass and the frame, a piezoresistor disposed on the beam, a metal wiring pattern and a pad electrode formed on the first surface of the frame and electrically connected to the piezoresistor, a cover plate disposed above and spaced apart from the proof-mass and the beam at the first surface side of the frame and fixed to a cover plate fixing area disposed on the first surface of the frame, and a projection disposed on the proof-mass at the first surface side to prevent the proof-mass from sticking to the cover plate.

Semiconductor sensor with projection for preventing proof mass from sticking to cover plate

A semiconductor sensor is disclosed that includes a proof mass, a frame that is arranged around the proof mass, a beam that is arranged at the surface side of the frame and is configured to support the proof mass, plural piezo-resistive elements arranged on the beam, plural metal wiring patterns and pad electrodes that are arranged on the surface of the frame and are electrically connected to the piezo-resistive elements, a cover plate that is fixed to the surface of the frame and is arranged to be spaced apart from the proof mass and the beam, and a cover plate fixing region for fixing the cover plate to the surface of the frame, the cover plate fixing region including a formation region for the metal wiring patterns.

Semiconductor sensor

A semiconductor apparatus includes lower conductive film strips, an inter-layer insulating layer, implanted conductive members, and upper conductive film strips. The lower conductive film strips are formed in a pattern closely adjacent in a line width orientation, electrically separated from each other. The inter-layer insulating layer is formed the lower conductive film strips. The implanted conductive members are implanted in connection holes formed in the inter-layer insulating layer at positions corresponding to both edge sides of the lower conductive film strips. The upper conductive film strips are formed on the implanted conductive members and the inter-layer insulating layer to connect the lower conductive film strips in series so that the lower conductive film strips, the implanted conductive members, and the upper conductive film strips form an electric coil.

Semiconductor apparatus having a built-in electric coil and a method of making the semiconductor apparatus

A semiconductor device includes a semiconductor substrate, an insulating film, and a fuse element. The semiconductor substrate includes main and back surfaces and a trimming opening penetrating therethrough from the back surface to the main surface. The insulating film is formed on the semiconductor substrate. The fuse element is formed on the main surface of the semiconductor substrate through the insulating film at a position facing the trimming opening. A method of manufacturing a semiconductor device includes the steps of forming a fuse element and forming a trimming opening. The forming step forms the fuse element on a main surface of a semiconductor substrate through an insulating film. The forming step forms the trimming opening from a back surface of the semiconductor substrate to the main surface of the semiconductor substrate at a position facing the fuse element after a formation of the fuse element.

Growing community of inventors

Osaka, Japan

Masami Seto