Hitachi-high-technologies Corporation

Masami Ooyama

Kazuhiro Zama

Hiroyuki Yamashita

Eiji Imai

Masayuki Hachiya

Keiichi Nagasaki

Hideyuki Okamoto

Rieko Hachiya, Legal Representative

Kimiko Hachiya, Legal Representative

An object mounting mechanism includes: a plate member on which an object is mounted. Bumps are arranged on an upper surface of the plate member which faces a reverse face of the object. In addition, the bumps are arranged sparsely in an area of a surrounding part of the plate member and densely toward an area of a center part of the plate member.

Inspection apparatus and inspection method

Selection with alignment marks of an optimal template, its identification and similarity judgment are conducted by a calculation function of a correlation value provided to a foreign matter inspection apparatus. In other words, the foreign matter inspection apparatus includes unit for registering feature points of alignment marks formed on a surface of an inspected object, unit for collecting image data of the alignment marks formed on the surface of the inspected object and a data processor for extracting a feature point from the image data and calculating a correlation value of both feature points, and registers the image data of the alignment mark on the basis of a threshold value of the correlation value.

Foreign matter inspection apparatus

The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection. An inspection apparatus includes: a first light irradiating unit for irradiating an object to be inspected with light; a first detector for detecting scattered light from the object to be inspected; a second light irradiating unit for irradiating the object to be inspected with light; a second detector for detecting light reflected from the object to be inspected, of light of the second light irradiating unit; a stage for moving an object to be inspected, which moves the object to be inspected so as to change irradiation positions on the object to be inspected, of the light of the first light irradiating unit and the light of the second light irradiating unit; an inspection coordinate detector for outputting information of coordinates of a position irradiated with light; an elevation control circuit for outputting height information of the object to be inspected on the basis of a detection signal from the second detector; and a data processing unit for calculating a warp amount of the object to be inspected on the basis of the information of the position coordinates from the inspection coordinate detector and the height information from the elevation control circuit.

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Hitachi, Japan

Masami Ooyama