On Semiconductor Trading, Ltd.

Other

Sanyo Electric Co., Ltd.

Semiconductor Components Industries, LLC

Sanyo Semiconductor Co., Ltd.

Masami Motegi

Katsuyoshi Mino

Masaru Kanakubo

Akira Iwabuchi

Ko Nishimura

Nobuhisa Onai

Masashi Terauchi

Takashi Higo

Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (), which are apart from each other, are firstly formed on the upper surface of a pad (A), and a chip component (B) and a transistor (C) are affixed at the same time. After that, a solder paste () is supplied to the upper surface of the pad (A) using a syringe (), a heatsink (D) is mounted on top of the solder paste (), and melting is caused by a reflow process. There is little risk of sinking of the solders () in the present invention since the solders () are discretely arranged on the upper surface of the pad (A).

Circuit device and method for manufacturing same

In a circuit device of the present invention, the lower surface side of a circuit board and part of side surfaces thereof are covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Circuit device and method of manufacturing the same

In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the circuit device is achieved mainly through the second resin encapsulant, a particle size of filler contained in the second resin encapsulant is made larger than a particle size of filler contained in the first resin encapsulant. Heat dissipation to the outside of the circuit device is greatly improved.

Circuit device

Provided is a circuit device manufacturing method for coating a bottom surface of a circuit board with a thin coating of sealing resin. In the present invention, a circuit board having a circuit element such as a semiconductor element embedded therein is placed in a molding die, and a resin sheet containing a thermosetting resin is interposed between the circuit board and a bottom surface of an inner wall of the molding die. Under this condition, the molding die is heated to about 180&#xb0; C., and a sealing resin in liquid form is injected through a gate. Thereby, the bottom surface of the circuit board can be coated with a thin coating of the sealing resin made of the molten resin sheet.

Resin sheet, circuit device and method of manufacturing the same

In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.

Growing community of inventors

Gunma, Japan

Masami Motegi