Idemitsu Petrochemical Co., Ltd.

Idemitsu Kosan Company, Limited

Yazaki Corporation

Masami Mihara

Shinobu Yamao

Shinichi Miura

Atsushi Fujii

Akitoshi Masuyama

Hiroyasu Yamato

Tohru Iwashita

Taizou Sugioka

Masahiro Nakamichi

Michio Funayama

Tomoo Tanaka

Hirosi Kawamura

Kazuhiro Nakata

Yoshiaki Miura

Hidezo Hosomi

Keiji Takamatsu

The present invention provides a connector, which may comprise a terminal fitting, a connector housing having a terminal receiving chamber in which the terminal fitting is at least partly disposed, and a waterproof body formed of thermoplastic elastomer composition. The thermoplastic elastomer composition may comprise (A) styrene-based elastomer component and (B) syndiotactic polystyrene-based polymer component. (A) Styrene-based elastomer component may comprise (A1) acid-modified styrene-based elastomer and (A2) unmodified styrene-based elastomer. The mass ratio of (A1) acid-modified styrene-based elastomer to the sum of (A1) acid-modified styrene-based elastomer, and (A2) unmodified styrene-based elastomer (A1/(A1+A2)) may be from 0.9 to 0.1. The mass ratio of the (A) styrene-based elastomer component to (B) syndiotactic polystyrene-based polymer component may be from 60:40 to 90:10.

Connector

Provided is a syndiotactic polystyrenic resin composition, of which the resin moiety comprises any of (A) a syndiotactic styrenic polymer (B) a rubber-like elastomer having affinity for the component (A), (E) a polymer having compatibility with or affinity for the component (A) and having a polar group, (F) a thermoplastic resin except (A), and (G) a polyolefin having MI of at most 25, and which contains from 10 to 350 parts by weight, relative to 100 parts by weight of the resin moiety, of (C) a fibrous filler, and from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120. Moldings of the composition have good impact resistance and warp little, still having good heat resistance and other good properties intrinsic to styrenic resins.

Styrenic resin composition and semiconductor carrier device

Flame retarded polystyrenic resin composition and molded article of a

There are disclosed a method for using a molding which comprises using a molding produced by thermoforming a sheet for thermoforming comprising a styrenic polymer having a high degree of syndiotactic configuration or a composition thereof in an atmosphere containing a chlorofluorohydrocarbon and also a method for using a molding which comprises using a molding produced by thermoforming a laminate comprising at least one surface layer of the above styrenic polymer or a composition thereof and an other layer of a thermoplastic resin or a composition thereof in an atmosphere the same as above-mentioned. The moldings to be employed in the present invention are excellent in chemical resistance, solvent resistance and resistance against CFC and HCFC, and the sheet for thermoforming and the laminate are useful as the starting raw materials for the aforesaid molding. According to the present invention, the moldings can be used without any problem as the inner liners of refrigerators (including internals inside door) in an atmosphere of chlorofluorohydrocarbon or in contact with heat-insulating material such as polyurethane foam, and the scrap resins at the time of molding can be recovered and readily reused.

Method for using molding

Styrenic resin composition

A glass fiber-reinforced synthetic resin composition is proposed which is particularly suitable as a molding material of chassis of electric and electronic instruments to satisfy the various requirements in this particular application. The resin composition comprises: (A) 100 parts by weight of a copolymeric resin of styrene and maleic anhydride or a derivative thereof, of which the molar fraction of the moiety of maleic anhydride or a derivative thereof is in the range from 3 to 20%; (B) from 1 to 30 parts by weight of a styrene-based thermoplastic elastomer, of which the weight fraction of the moiety of styrene is in the range from 5 to 50%; (C) from 5 to 80 parts by weight of glass fibers, (D) from 5 to 30 parts by weight of a bromine-containing organic compound as a flame retardant; and (E) from 2 to 15 parts by weight of antimony trioxide.

Novel resin composition and chassis for electronic instruments shaped

Growing community of inventors

Ichihara, Japan

Masami Mihara