Stanley Electric Co., Ltd

Masami Kumei

Masanori Sato

Mitsunori Harada

Takaaki Sakai

Takashi Ebisutani

Soji Owada

Toshimi Kamikawa

Koichi Takayama

Wakako Niino

A light emitting device is provided, including a resin which can be manufactured according to a simple process and deliver a desired scattering property. The light emitting device is manufactured according to a step for mixing two or more types of immiscible liquid materials to obtain a composition containing at least two types of materials phase-separated in a sea-island structure, and a step for arranging the composition in proximity to an LED chip, curing the composition with the sea-island structure being maintained, thereby forming an encapsulation resin. Accordingly, it is possible to form an island region which serves as a scattering center, according to a simple step of mixing materials.

Light emitting device including resin and manufacturing method for the same

A light emitting device is provided which has a reflector having a reflection surface made of porous alumina having an apparent density of 2.5 to 3.3 g/cm, and an LED disposed on the reflection surface or near the reflection surface. There are provided: a light emitting device equipped with an LED chip and a reflector having a high reflectivity relative to near infrared to ultraviolet rays irradiated from an LED chip and fluorescent material; and the reflector.

Light emitting device with a porous alumina reflector made of aggregation of alumina particles

A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin. The first resin extends along from an inner surface of the first recessed portion up to an inner surface of the second recessed portion to cover the inner surface of the second recessed portion. Accordingly, the first resin is recessed at its center area toward the semiconductor light emitting device to form a curved upper surface, and the second resin on the first resin is not in contact with the housing.

Semiconductor light emitting apparatus

Growing community of inventors

Tokyo, Japan

Masami Kumei