Hitachi, Ltd.

Hitachi Techno Engineering Co., Ltd.

Masami Kawaguchi

Kiyonori Kogawa

Nobuaki Ooki

Akira Nagai

Haruo Akahoshi

Motoyo Wajima

Shiro Kobayashi

Akimi Miyashita

Mutsumasa Fujii

Hideyasu Murooka

Masayuki Kyooi

Keiichiro Torii

Minoru Kubosawa

The invention presents a method of finishing a printed circuit board by using a soluble chloride added to a soft etching solution, the soluble chloride provides a source of chloride ions that beneficially combine with plated copper to form a protective CuCl layer. The protective layer is desirably used to prevent overetching of a copper film in a via or through-hole of a printed wiring board.

Method of finishing a printed wiring board with a soft etching solution

The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.

Printed circuit board and method and apparatus for making same

A hot press including a displaceable sleeve for surrounding materials of a multi-layer substrate under a reduced pressure condition, a gas pressurizing condition and a heating condition with thermal plates. Upper and lower sealing units seal an interior of the sleeve, with a mechanism lowering and raising the sleeve. A pilot check mechanism prevents a lower bolster from raising/lowering upon the reduced pressure condition and the gas pressure condition, and a retainer maintains the lowered or raised condition of the sleeve. The multi-layer substrate is formed under the reduced pressure condition and the gas pressure condition. Accordingly, the atmosphere and moisture between the materials of the multi-layer substrate and volatile composition are removed. Additionally, a void generated during the heat and pressure process by the heating plates is eliminated from the multi-layer substrate. By carrying out the formation of the multi-layer substrate at the heat and pressure by the heating plates under the gas pressure condition, a final dimensional precision and shape are enhanced and a warpage or twist is suppressed.

Hot press

Growing community of inventors

Hadano, Japan

Masami Kawaguchi