Nec Tokin Corporation

Tokin Corporation

Nec Tokin Toyama, Ltd.

Masami Ishijima

Yasuhisa Sugawara

Masanori Takahashi

Satoshi Iwai

Yusuke Hoshina

Tadamasa Asami

Kenji Araki

Satoshi Abe

Kazuaki Saito

Hitoshi Takata

A solid electrolytic capacitor according to one aspect of the present disclosure includes: an anode body made of a valve metal; a dielectric layer formed on the anode body; and a solid electrolyte layer formed on the dielectric layer. The solid electrolyte layer includes: a first conductive polymer layer formed on the dielectric layer and heterogeneously doped with a monomolecular dopant; a block layer formed on the first conductive polymer layer; and a second conductive polymer layer formed on the block layer and composed of a self-doped-type conductive polymer containing a plurality of side chains containing a functional group that can be doped. The block layer blocks a migration of the self-doped-type conductive polymer from the second conductive polymer layer into the first conductive polymer layer and/or a migration of the self-doped-type conductive polymer from the second conductive polymer layer into pores of the porous anode body.

Solid electrolytic capacitor and method for manufacturing solid electrolytic capacitor comprising a block layer formed using a conductive polymer heterogeneously doped with a polymer dopant

A solid electrolytic capacitor according to an aspect includes an anode body made of a valve metal, a dielectric layer formed on the anode body, a solid electrolyte layer formed on the dielectric layer, and a cathode body layer formed on the solid electrolyte layer. The solid electrolyte layer includes a first layer containing a first conductive polymer doped with a monomolecular dopant, and a second conductive polymer composed of a self-doped-type conductive polymer containing a plurality of side chains containing a functional group, the functional group being able to be doped, and a second layer formed on the first layer and containing a third conductive polymer doped with a polymer dopant; and the first conductive polymer is in contact with the third conductive polymer (the second layer).

Solid electrolytic capacitor using a doped conductive polymer

A solid electrolytic capacitor includes a capacitor element, an outer anode terminal, an outer cathode terminal and an outer mold. The capacitor element has an anode lead wire, an anode body and a cathode layer. The capacitor element has an upper surface and a lower surface in an up-down direction. The outer cathode terminal and the outer anode terminal are positioned away from each other in a predetermined direction perpendicular to the up-down direction. The outer cathode terminal has an upper portion, a lower portion and a connecting portion. One of the upper portion and the lower portion is longer than a remaining one of the upper portion and the lower portion in the predetermined direction. The outer mold covers the capacitor element so that each of the outer anode terminal and the outer cathode terminal is partially exposed to an outside of the solid electrolytic capacitor.

Solid electrolytic capacitor

An electrolytic capacitor according to an aspect of the present disclosure includes a valve metal, a dielectric oxide film layer formed on a surface of the valve metal, a surface treatment agent layer formed on the dielectric oxide film layer, and an electrolyte layer formed on the surface treatment agent layer. The electrolyte layer includes a conductive polymer layer and an ionic liquid. For example, the conductive polymer layer is formed so that the conductive polymer layer is in contact with the surface treatment agent layer, and at least some of voids present in an interface between the conductive polymer layer and the surface treatment agent layer are filled with the ionic liquid.

Electrolytic capacitor and method for manufacturing electrolytic capacitor

A solid electrolytic capacitor according to an aspect of the present invention includes an anode conductor including a porous valve metal body, a dielectric layer formed on a surface of the anode conductor, and a solid electrolyte layer including a conductive polymer layer formed on a surface of the dielectric layer, in which the solid electrolyte layer includes a first solid electrolyte layer formed on a surface of the dielectric layer, and a second solid electrolyte layer formed on a surface of the first solid electrolyte layer, and at least one continuous or discontinuous layer containing an amine compound exists between the first and second solid electrolyte layers, and inside the second solid electrolyte layer.

Method of manufacturing a solid electrolytic capacitor having solid electrolytic layers and an amine compound layer

Solid electrolytic capacitor and its manufacturing method

In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in a first direction to a position near an anode terminal forming portion. The anode terminal forming portion is connected to the frame body and used for forming the anode terminal. The cathode terminal forming portion is connected to the frame body and used for forming the cathode terminal. The anode terminal forming and the cathode terminal forming portions are spaced to each other in the first direction on a principal surface of the frame body.

Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method

A face-down terminal solid electrolytic capacitor with the increased strength between electrode terminals and a casing resin is provided. The face-down terminal solid electrolytic capacitor has a structure where a mold structure in which a lead frame and capacitor elements fixed to the lead frame are overmolded with a casing resin is cut along cutting planes respectively passing through an anode terminal forming portion and a cathode terminal forming portion of the lead frame so that end surfaces of an anode terminal and a cathode terminal are exposed. In the lead frame, the anode terminal forming portionand the cathode terminal forming portionare provided so as to face each other. The anode terminal forming portion has a concave portionon the board mount side and a convex portionon the opposite side, which are formed by deforming part of the anode terminal forming portion in a direction perpendicular to a board mount surface. The concave portion is applied with plating. The convex portion has a flat portion parallel to the board mount surface and serving as a welding margin, an inclined portioncontinuous with the flat portion and inclined so as to approach the board mount surface as going away from the flat portion, and projecting portionson lateral sides of the convex portion. By cutting along a cutting plane, the anode terminal is formed so as to have a cut end surface, a fillet surface, and a board mount surface as exposed surfaces.

Solid electrolytic capacitor with face-down terminals, manufacturing method of the same, and lead frame for use therein

In a chip type solid electrolytic capacitor, an anode terminal is provided with an anode terminal lower surface exposed from a package lower surface and an anode terminal end surface adjacent to the anode terminal lower surface and exposed from a first package end surface. The cathode terminal is also provided with a cathode terminal lower surface and a cathode terminal end surface. The anode terminal end surface is provided with an anode terminal dent surface upwardly extending from the boundary with the anode terminal lower surface. The anode terminal dent surface is plated. The cathode terminal end surface is also provided with a cathode terminal dent surface which is plated.

Chip type solid electrolytic capacitor having plated fillet surface and method of manufacturing the same

In a chip-type solid electrolytic capacitor including a capacitor element, anode terminal and cathode terminal are electrically connected to the capacitor element. A casing resin covers the capacitor element and the anode and cathode terminals. Each of the anode and cathode terminals has a bottom mount surface to be mounted on a circuit board and an exposed surface substantially perpendicular to the bottom mount surface and exposed at a side surface of the casing resin. Each of the exposed surfaces is subjected to plating to have a plated portion.

Growing community of inventors

Sendai, Japan

Masami Ishijima