Shinko Electric Industries Co., Ltd.

Masakuni Kitajima

Kei Murayama

Shigeaki Suganuma

Yoshihiro Ihara

Takehito Terasawa

Ryuichi Matsuki

Hiroyuki Miyajima

A substrate holding apparatus includes a baseplate, an adhesive layer disposed on the baseplate, and an electrostatic chuck disposed on the adhesive layer to hold an object, wherein a first side surface of a first portion of the electrostatic chuck is at a same position in a plan view as a second side surface of a second portion of the baseplate, the first portion being in contact with a first face of the adhesive layer, the second portion being in contact with a second face of the adhesive layer, wherein the adhesive layer has a protruding part extending outwardly from the first side surface and the second side surface, and wherein the first face and the second face are flat planes extending from an inside of the first side surface and the second side surface to an outside of the first side surface and the second side surface.

Substrate holding apparatus

A substrate includes a substrate base, first contact parts arranged in a pattern on a surface of the substrate base, and leads respectively having a generally U-shape with a flexible part, a first end fixed to a corresponding one of the first contact parts, and a second end that is located a predetermined distance away from the first end relative to the surface of the substrate base. The first and second ends of each of the leads are substantially aligned in a direction perpendicular to the surface of the substrate base in a state where the second end of each lead is pushed by a target object and deformed thereby in order to electrically connect the substrate to the target object.

Substrate having leads

A heat radiation component configured to be provided through a thermal interface material on a semiconductor device mounted on a board includes a first layer to be positioned on a first side and a second layer stacked on the first layer to be positioned on a second side farther from the semiconductor device than the first side. The coefficient of thermal expansion of the second layer is lower than the coefficient of thermal expansion of the first layer.

Heat radiation component and semiconductor package including same

A lead pin includes a shaft portion, a connection head portion provided to a top end side of the shaft portion, and having a diameter which is larger than a diameter of the shaft portion, wherein the connection head portion includes a bonding surface on an opposite side to the shaft portion side, and the bonding surface includes a flat surface provided in a center part, a convex surface which is provided like a ring shape to an outside of the flat surface and rounded by a radius R like a convex shape, and a concave surface which is provided like a ring shape to an outside of the convex surface and rounded by a radius R like a concave shape.

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Nagano, Japan

Masakuni Kitajima