Kabushiki Kaisha Toshiba

Masako Yoshida

Yukihito Oowaki

Makoto Yoshimi

Kazunori Ohuchi

Tsuneaki Fuse

Atsushi Kameyama

Takehiro Hasegawa

Shinichiro Shiratake

Ryo Fukuda

Kiyofumi Ochii

Shigeyoshi Watanabe

Mitsuo Saito

Masayuki Koizumi

Masatoshi Sekine

Hiroshige Fujii

Ken-ichi Maeda

An integrated circuit has first and second logic circuits having common input terminals and the same complementary logic function. The first logic circuit has a p-type FET circuit block and an n-type FET circuit block each with a high threshold value, while the second logic circuit has a p-type FET circuit block and an n-type FET circuit block each with a low threshold value. An output switch circuit intervenes between the p-type FET and n-type FET circuit blocks in each logic circuit and controls the power supply connection to each logic circuit. In operation, the output of the second logic circuit is connected to the output terminal to realize a low power consumption. In the standby state, the output of the first logic circuit is connected to the output terminal to realize a low leakage current.

Semiconductor integrated circuit

A semiconductor device includes a semiconductor layer used as a substrate formed on an insulating film, a plurality of MOS transistors arranged on the semiconductor layer and each having a gate, a source, and a drain, a pair of MOS transistors of the plurality of MOS transistors constituting a detection circuit for detecting magnitudes of potentials applied to the gates as a difference between conductances of the pair of transistors, and a diffusion layer region of the same conductivity type as that of the semiconductor layer, arranged on one of portions of the sources and drains of the pair of MOS transistors constituting the detection circuit, for connecting portions serving as the substrates of the pair of MOS transistors to each other.

Semiconductor memory device including a pair of MOS transistors forming a detection circuit

A level converter circuit includes two p-channel MOSFETs and two n-channel MOSFETs of gate-grounded type which receive complementary signals from a logic circuit, p-channel cross-coupled FETs, and n-channel cross-coupled FETs. The two FETs constructing each cross-coupled FETs can be driven by complementary inputs by supplying an output of the logic circuit operated on a low voltage and a logically inverted output thereof to each cross-coupled FETs via the gate-grounded FETs, and as a result, the gain characteristic of the cross-coupled FETs can be enhanced. The level converter circuit with low power consumption which has large tolerance for the element characteristic and converts a logic level which is as low as approximately 0.5V to approximately 1V to 3V which is a normal logic level.

Level converter circuit

A semiconductor integrated circuit has a logic circuit operated at a small power supply voltage of about 0.5V, wherein a noise margin of the logic circuit can be set at a larger value even if characteristics of the circuit vary depending upon manufacturing process conditions. Satisfactory speed can be ensured during an operation and power consumption can be reduced during a stand-by time. This is attained by controlling individual potentials of first and second conductivity type wells in which a logic circuit is formed. For this purpose, two voltage supply circuits for controlling voltages of the wells and a logic threshold voltage generator are provided.

An integrated circuit has configurable logic blocks that are reconfigurable, hard-wired logic blocks that carry out fixed operations, and a memory. The memory stores configuration data for configuring the configurable logic blocks, block-connection data for determining connections between the configurable and hard-wired logic blocks, and partial-circuit-connection data for determining connections between partial circuits each of which consists of logic blocks selected among the configurable and hard-wired logic blocks. These pieces of data are shared by the logic blocks to reduce the number of memories in the integrated circuit and improve the packaging density of the integrated circuit.

Configurable integrated circuit and method of testing the same

Method of manufacturing semiconductor memory device

Semiconductor memory device

In a semiconductor memory device wherein a plurality of memory cell units formed by connecting a plurality of memory cells in series are provided and each of the memory cell units is connected to a bit line, the semiconductor memory device comprises control circuit for directly reading data of a register cell during a reading operation when the previous row address designates the same memory cell as the present row address, and a data changing controlling circuit for changing data of an arbitrary memory cell of the memory cell unit to data of the memory cell closest to the bit line contact in the memory cell unit, and a row decoder for corresponding row addresses which select the memory of memory cell units, to the upper addresses than the parts of the row addresses which select a memory unit among the memory cell units.

A semiconductor memory device comprises a memory cell array including NAND type memory cell units arranged in matrix and having a plurality of dynamic type memory cells connected in series, a plurality of word lines, a plurality of bit lines arranged within the memory cell array, the plurality of bit lines including a bit line pairs which are arranged adjacent to each other or between which at least one bit line is interposed, and a plurality of sense amplifiers of a folded bit line type, provided in each of the plurality of bit line pairs, in which the memory cells are provided in positions corresponding to intersections of the bit lines and the word lines, and complementary data are written to two memory cells connected to each of the plurality of bit line pairs and one word line, and the two memory cells store one-bit data.

Growing community of inventors

Yokohama, Japan

Masako Yoshida