Shinko Electric Industries Co., Ltd.

Masako Sato

Hitoshi Kondo

Tomoyuki Shimodaira

Shunichiro Matsumoto

Toshihisa Yoda

A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.

Wiring substrate and method of manufacturing the same

A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin having the same composition. The plural insulation layers are formed with a filler having the same composition. The filler content of each of the plural insulation layers ranges from 30 vol % or more to 65 vol % or less. The thermal expansion coefficient of each of the plural insulation layers ranges from 12 ppm/&#xb0; C. or more to 35 ppm/&#xb0; C. or less.

Wiring substrate

In a wiring board, a plurality of wiring layers and a plurality of insulating layers are alternately stacked. The wiring layers are electrically connected to one another through via holes formed in the insulating layers. The wiring board includes: a connection pad which is disposed on one of the wiring layers that is on the inner side of an outermost wiring layer; and an external connection terminal which is disposed on the connection pad, and which is projected from the surface of the wiring board. The external connection terminal is passed through the outermost wiring layer.

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Nagano, Japan

Masako Sato