Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Tokyo Shibaura Electric Co., Ltd.

Masako Nakahashi

Hiromitsu Takeda

Makoto Shirokane

Seiichi Suenaga

Kiyoshi Iyogi

Tatsuo Yamazaki

Hiroki Inagaki

Kunihiko Wada

Kazuhiro Yasuda

Shuichi Komatsu

Takaaki Yasumoto

Tsutomu Okutomi

Nobuo Iwase

Mitsutaka Homma

Mikio Okawa

Kazumi Shimotori

Toshirou Yanazawa

Shozi Niwa

Takao Suzuki

Akio Hori

Itaru Watanabe

Akihiko Tsuge

Hisashi Yoshino

Miho Maruyama

Atsuhiko Izumi

Kiyoshi Osabe

Tetsuzou Sakamoto

Shigeru Miyakawa

Shoji Niwa

Rika Takigawa

Masayuki Yamada

A gas turbine apparatus having a plurality of stages of rotor.stator blade and utilizing fuel containing 0.5 ppm or more of vanadium. A plurality of stages of the rotor.stator blade have a stage which is driven by combustion gas not including vanadium corrosion suppressing agent and a stage which is driven by combustion gas including vanadium corrosion suppressing agent and is controlled in its combustion gas temperature at below 1,458 K. In addition, the plurality of stages of the gas turbine are supplied with different kinds of combustion gases according to the temperature of each stage. Or, by disposing at least two systems of fuel supplying mechanism to one combustion chamber, the combustion temperature is controlled according to the kinds and the mixing ratio of the fuels. Therewith, while suppressing corrosion of high temperature member due to V and S, the deposition of the reaction products due to the vanadium corrosion suppressing agent and the like can be suppressed. Thereby, the system availability ratio can be improved and long life of the gas turbine can be realized. Further, due to high combustion gas temperature, efficiency can be enhanced.

Gas turbine apparatus using fuel containing vanadium

A ceramic coating layer which is not less than 70 .mu.m in the maximum height Rmax of its profile curves and not less than 45 .mu.m in the 10-point average roughness, or which is less than 650 HV in Vickers hardness is provided on a metallic substrate. A heat-resistant member of such composition is excellent in thermal fatigue resistance and keeps an excellent heat resistance for a long period of time. Quality of a heat-resistant member is evaluated by, measuring at least one of roughness and hardness of a ceramic coating layer on a metallic substrate. According to this method, it is possible to easily and accurately evaluate a thermal resistant life of a heat-resistant member.

Heat-resistant member and a method for evaluating quality of a

A heat resisting member having ceramics heat shield layers which is directly formed on a metal base material or formed on it via a metal bonded layer formed on the metal base material. The ceramics heat shield layers comprise a first ceramics layer which is formed on the metal base material or the metal bonded layer and has a high elastic modulus, high hardness and high density, and a second ceramics layer which is formed on the first ceramics layer and has a low elastic modulus, low hardness and low density. Delamination from the neighborhood of the interface or oxidation of the lower layer can be prevented by the first ceramics layer which is formed on the metal base material or the metal bonded layer. Thermal shock resistance and heat shielding effect of the ceramics heat shield layers as the whole can be enhanced by the second ceramics layer. And, if necessary, a third ceramics layer having a high elastic modulus, high hardness and high density may be formed on the second ceramics layer in order to improve the abrasion resistance and the resistance against a damage due to flying substances.

Heat resisting member and its production method

The brazing filler of the present invention is excellent in wetting properties towards the open end of a ceramic cylinder and a metal sealing cap can be sealed well on the open end. The present brazing filler comprises Ag, Cu and active metal, in which the Cu-active metal compound is contained in an amount of not more than 40% by volume.

Brazing fillers for sealing vacuum-tight vessels, vacuum-tight vessels

A method of manufacturing a semiconductor device comprising a ceramics cylinder, a metal seal member closing an open end of the cylinder, a semiconductor element located within the cylinder and having electrodes, and leads or electrodes connected to the electrodes of the semiconductor element and extending from the cylinder. The method comprises the steps of coating powder of active metal consisting of Ti and/or Zr on the end face of the ceramics cylinder without heating the ceramics cylinder, in an amount of 0.1 mg/cm.sup.2 to 10 mg/cm.sup.2, mounting a layer of brazing filler metal on the end face of the ceramics cylinder, which have been coated with the powder of the active metal, placing the metal seal member on the layer of brazing filler metal, and heating the ceramics cylinder, the metal seal member, and the layer of brazing filler metal, thereby melting the layer of brazing filler metal and, thus, brazing the metal seal member to the open end of the ceramics cylinder.

Method of manufacturing a semiconductor device

According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element selected from the Group IVa elements and a metal having a melting point higher than that of the metal brazing powder, the metal brazing material bonding said board and said pins. According to the present invention, metal, such as input/output terminal pins can very firmly be bonded to ceramic, such as a circuit board, within an atmosphere of, for example, N.sub.2 gas without the scattering of any brazing material in which case, unlike the prior art method, any vacuum furnace is not employed.

Brazing paste for bonding metal and ceramic

According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazing powder, at least one element selected from the Group IVa elements and a metal having a melting point higher than that of the metal brazing powder, the metal brazing material bonding said board and said pins. According to the present invention, metal, such as input/output terminal pins can very firmly be bonded to ceramic, such as a circuit board, within an atmosphere of, for example, N.sub.2 gas without the scattering of any brazing material in which case, unlike the prior art method, vacuum furnace is not employed.

The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each with terminal pins bonded to a high thermal conductivity ceramics circuit board. According to the present invention, an electronic component part is provided in which terminal pins are bonded to a high thermal conductivity ceramics circuit board by a brazing metal, containing at least one kind of Group IVa elements. In another aspect of the present invention a method is provided for manufacturing electronic component parts, which comprises the step of attaching terminal pins to a high thermal conductivity ceramics circuit board by a brazing paste layer comprised of brazing metal powder containing at least one kind of Group IVa elements, an acrylic binder with a carboxylic group as a substituent group and organic solvent, and heating the resultant structure in an atmosphere containing nitrogen as a principal element so that terminal pins are firmly bonded to a circuit board.

Brazing paste

A method of manufacturing an air-tight ceramic container is disclosed. This method includes the steps of coating an active metal consisting of Ti and/or Zr on an opening end face of a ceramic tubular member in an amount of 0.1 to 10 mg/cm.sup.2, thereby forming an active metal layer, placing a brazing filler metal on the active metal layer, placing a metal cover member for shielding an opening portion of the ceramic tubular member so that a peripheral portion end face of the metal cover member is in contact with the brazing filler metal, and melting the brazing filler metal by heating, thereby brazing the metal cover member to the opening end face of the ceramic tubular member.

Air-tight ceramic container

A nitride ceramic member is maintained at a vacuum of 1.times.10.sup.-4 Torr or less at a temperature of 1,000.degree. C. or more, and a metal vapor is brought into contact with the surface of the nitride ceramic member. A nitride is reacted with the metal in the surface portion of the ceramic member, and a metallized layer is formed on the surface of the member. If AlN is used as a nitride ceramic material, the AlN member is maintained at the vacuum at the high temperature and a Ti vapor is brought into contact wit the surface of the AlN member to form a TiN coating layer on the surface of the AlN member. A BN or graphite mask is formed on the surface of the nitride ceramic member and the above method is practiced to selectively form a metallized layer on the non-masked member surface. By selectively forming a metallized layer by using AlN, a highly thermal-conductivity substrate having a conductive layer formed on the AlN base can be prepared.

Method of coating a nitride ceramic member

Electronic component parts and method for manufacturing the same

A method of forming a nitride ceramic-metal complex material without using a special bonding material. This method comprises bringing a metallic material into contact with the surface of a nitride ceramic material, heating under vacuum the nitride ceramic material so as to dissociate the surface of the nitride ceramic material into nitrogen and a precursor of the ceramic material, thereby allowing the dissociated precursor to react with the metallic material and to achieve bonding between the nitride ceramic material and the metallic material. A nitride ceramic-metal complex material produced by the above method is also proposed.

Nitride ceramic-metal complex material and method of producing the same

There is disclosed a method of joining Ni-base heat-resisting alloys which comprises forming, under an inert atmosphere, an aluminum layer on at least surfaces to be joined of a constructional member which has been divided into a plural number of parts composed of a Ni-base heat-resisting alloy reinforced by a .gamma.' phase in Ni.sub.3 Al system, followed by heating the parts so that said aluminum is dispersed in said Ni-base heat-resisting alloys, the joining portion (joint) contains substantially no .beta.-NiAl phase and a .gamma.'-Ni.sub.3 Al phase is dispersed therein to join the parts. The joint provided by the method according to the present invention has been improved in its strength and corrosion resistance at a high temperature. Further, the method according to the present invention can be carried out with a high degree of freedom in supplying a joining filler metal.

Method of joining Ni-base heat resisting alloys

A method for preparing a highly heat conductive substrate which comprises interposing an active layer with a thickness of 0.5 to 10 .mu.m comprising silver (Ag) and an active metal selected from the group consisting of titanium, zirconium and hafnium, and also copper (Cu) optionally, between an aluminium nitride (AlN) substrate and a copper member; and joining said aluminium nitride (AlN) substrate and said copper (Cu) member with each other by heating. A copper wiring sheet comprising the above active layer is also usable in the method.

Method for preparing highly heat-conductive substrate and copper wiring

Disclosed is a method of measuring the deterioration degree of heat resistant parts made of a 12% Cr steel containing at least one of Mo and W and used under high temperatures on the basis of the amount of Laves phase precipitated within said 12% Cr steel.

Growing community of inventors

Tokyo, Japan

Masako Nakahashi