Growing community of inventors

Fujimino, Japan

Masaki Yazaki

Average Co-Inventor Count = 2.48

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 18

Masaki YazakiKazunori Oda (8 patents)Masaki YazakiMasachika Masuda (3 patents)Masaki YazakiKoji Tomita (3 patents)Masaki YazakiKazuyuki Miyano (3 patents)Masaki YazakiAtsushi Kurahashi (3 patents)Masaki YazakiSatoshi Shibasaki (3 patents)Masaki YazakiKazuhito Uchiumi (3 patents)Masaki YazakiMasaki Yazaki (11 patents)Kazunori OdaKazunori Oda (20 patents)Masachika MasudaMasachika Masuda (85 patents)Koji TomitaKoji Tomita (56 patents)Kazuyuki MiyanoKazuyuki Miyano (5 patents)Atsushi KurahashiAtsushi Kurahashi (4 patents)Satoshi ShibasakiSatoshi Shibasaki (4 patents)Kazuhito UchiumiKazuhito Uchiumi (3 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Dai Nippon Printing Co., Ltd. (11 from 3,202 patents)


11 patents:

1. 9899583 - Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

2. 9870983 - Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

3. 9773960 - Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

4. 9553247 - Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

5. 9543169 - Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

6. 9412923 - Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

7. 9362473 - Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

8. 9257306 - Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

9. 9214414 - Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

10. 9159655 - Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

11. 8933548 - Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

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as of
1/5/2026
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