Nec Corporation

The Furukawa Electric Co., Ltd.

Masaki Yasuhara

Akira Matsuda

Yoshiaki Ogiwara

Hard discs constituting a disc array system are arranged at locations far from one another so as to eliminate their simultaneous damage due to a local disaster and concentration of the processing load thereby suppressing the recovery time upon hard disc failure. It is possible to realize continuous operation without system down even when the other disasters have occurred. A plurality of hard disc devices are arranged at different locations far from one another, write-in data from a server device is mapped by the RAID method, and a data packet added by the RAID information and the error correction code is distributed to the respective hard discs. Moreover, the line connection device for performing data transfer to the hard disc device has the RAID control function while the main control device is dedicated to monitoring of the hard disc devices and data recovery process upon occurrence of a failure. Moreover, backup of the restored data is transmitted to the server device during a failure recovery process so that recovery re-execution can easily be performed by using the backup when data recovery has not terminated normally.

Data storage system and control method thereof

A data transfer control apparatus is disclosed for controlling conflict of data transfer on a data bus connected to a microprocessor through a bridge circuit. The bridge circuit includes a monitoring unit. When an execution instruction for MPC transfer is issued during DMA transfer, the monitoring unit measures a time period over which the data bus is to be occupied with the MPC transfer. When the PCI bus is to be occupied with the MPC transfer for a predetermined time period, the monitoring unit does not suspend the DMA transfer but performs the MPC transfer after the completion of the DMA transfer.

Control, of conflict between MPC transfer and DMC transfer with measurement of instruction execution time

A plating method for a nickel-titanium alloy member is provided which comprises the steps of: subjecting a nickel-titanium alloy member to an anodic electrolyzing treatment and a cathodic electrolyzing treatment in succession by using an electrolyte containing hydrochloric acid as an essential component thereof, in particular, an electrolyte having a chloride ion concentration of 0.1 mol/l or more and a pH value of 2 or less, or an electrolyte having a chloride ion concentration of 0.4 mol/l or more, or still preferably, an electrolyte having a chlorine ion concentration of 0.3 mol/l or more and a pH value of 2 or less; strike plating the treated nickel-titanium alloy member with a desired metal; and electroplating the struck nickel-titanium alloy member with a desired metal. The adhesion between the nickel-titanium alloy member and a plating layer is very good.

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Tokyo, Japan

Masaki Yasuhara