The Furukawa Electric Co., Ltd.

Masaki Wakaba

Yasutaka Higa

A semiconductor device includes: a mesa portion that has a semiconductor layered structure, and that extends in a predetermined direction; an extending portion that extends along the mesa portion and that is separated by trench grooves arranged respectively on both sides of the mesa portion; insulating portions that are made from an insulating material, and are arranged in the respective trench grooves; and a conductive portion that is arranged on an upper side of the mesa portion. Further, at least one of the insulating portions adheres intimately to the mesa portion, and forms a gap between the at least one of the insulating portions and the extending portion in at least a part of an extending direction of the mesa portion, and the conductive portion is arranged across at least one of the insulating portions and the mesa portion.

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Tokyo, Japan

Masaki Wakaba