Lintec Corporation

Asahi Kasei Microdevices Corporation

Other

Masaki Tsujimoto

Kenji Kobayashi

Takahisa Yoshioka

Ken Tanaka

Takuya Ishida

Hideo Numata

Keisuke Tokubuchi

Tsuyoshi Kurita

Koji Okamoto

Hiroshi Saito

Kimihiko Kawasaki

A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, and a signal processing IC are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed on a side surface of the encapsulating portion and is spaced apart from the conductor; and an element supporting portion that is comprised of a metal plate or a semiconductor substrate, supports the at least one magnetoelectric conversion element and a metal member on a surface on a same side as the first surface, and is spaced apart from the conductor.

Current sensor

A current sensor is configured by at least one magnetoelectric conversion element, a conductor, and a signal processing IC being encapsulated by an encapsulating portion. The current sensor includes a pair of first lead terminals that is partially exposed outside of the encapsulating portion, is electrically connected to the conductor, inputs the measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor; and a supporting portion that supports the at least one magnetoelectric conversion element, the signal processing IC, and the metal member on a first surface, is separated from the conductor, and is separate from the metal member.

A current sensor includes at least one magnetoelectric conversion element, a conductor that at least partially surrounds the at least one magnetoelectric conversion element in a plan view and through which a measurement current to be measured with the at least one magnetoelectric conversion element flows, an element supporting portion comprised of a semiconductor substrate, and supports the at least one magnetoelectric conversion element and the conductor on a first surface, a signal processing IC that processes a signal that is output from the at least one magnetoelectric conversion element, an encapsulating portion that encapsulates the at least one magnetoelectric conversion element, the conductor, and the signal processing IC, and a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion and is electrically connected to the conductor, inputs the measurement current to the conductor and outputs the measurement current from the conductor.

A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, a signal processing IC, an IC supporting portion, and an element supporting portion are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed outside the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; and a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor. The element supporting portion further supports the metal member on a surface on the same side as a first surface on which the IC supporting portion supports the signal processing IC.

There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer. The mounting apparatussticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table. The mounting apparatusincludes a pre-cut meansfor forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking meansfor peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.

Mounting apparatus and mounting method

A peeling apparatusincludes a peeling tablesupporting a wafer W on which a sheet S is stuck and a sheet peeling unitdisposed above the peeling table, in which sheet S can be peeled off with relative movement of the sheet peeling unitand the peeling table. The peeling apparatusincludes a support rollof peeling tape PT, first and second rollsbonding the peeling tape PT to the sheet S surface, and a winding rollof the peeling tape PT. Peeling-off is performed in a state of forming an initial peeling angle asuch that a peeling tape PT is folded in an aperture C formed between the second rolland the sheet S, and afterwards the sheet S is peeled off at subsequent peeling angle acorresponding to a diameter of the second roll

Sheet peeling apparatus and sheet peeling method

A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unitincludes a tablehaving a suction facein the upper face. The suction facesucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face, a grooveis formed. By sucking through the suction face, the inside of the groovebecomes negative pressure and the dicing tape T is sunk therein.

Suction unit

There is provided a sheet peeling apparatus and a peeling method using a plurality of peeling units. A sheet peeling apparatus for peeling off a sheet stuck on the surface of a semiconductor wafer by using an adhesive tape of a width narrower than that of the sheet, which is equipped with a peeling head for peeling off the sheet by pulling the adhesive tape in an obtuse angled direction in a state stuck to the end portion of the sheet; and first and second rollers for peeling off the sheet by pulling the adhesive tape in the substantially right angle or acute angle direction in a state stuck with the adhesive tape in the direction across the sheet. Either of the peeling units are selectively used in accordance with the type of the sheet.

Sheet peeling apparatus and peeling method

A sticking apparatusincludes a sticking tablesupporting a semiconductor wafer W and a sticking unitsticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unitincludes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unitprovided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unitincludes a moving memberthat moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unitenabling to stick the adhesive sheet S on the wafer W.

Sticking apparatus and sticking method

Chips C which have already been diced are attached to a ring frame F using an adhesive sheet, and a protective sheet Sis attached to a circuit pattern surface of the chips C. The chips C, along with a ring frame F, are held in place on a tableof a protective sheet peeling apparatus. A supply portion for an adhesive tape T is disposed in the vicinity of a table, and the supplied adhesive tape T is attached to the protective sheet S. When the protective sheet Sis peeled from the circuit pattern surface, peeling starts from corner portions of the chips C or opposing corner positions by pulling the adhesive tape T.

Apparatus for peeling protective sheet

Chips C which have already been diced are attached to a ring frame F using an adhesive sheet, and a protective sheet S is attached to a circuit pattern surface of the chips C. The chips C, along with a ring frame F, are held in place on a table of a protective sheet peeling apparatus . A supply portion for an adhesive tape T is disposed in the vicinity of a table , and the supplied adhesive tape T is attached to the protective sheet S . When the protective sheet S is peeled from the circuit pattern surface, peeling starts from corner portions of the chips C or opposing corner positions by pulling the adhesive tape T.

Method for peeling protective sheet

A die bonding sheet sticking apparatus and a method of sticking a die bonding sheet which, in the production of small electronic components, for example, semiconductor chips, effect sticking to a back surface of wafer a die bonding sheet capable of functioning not only as a protective tape at the time of dicing but also as an adhesive for die bonding at the time of die bonding of semiconductor chips after dicing onto a lead frame.

Die bonding sheet sticking apparatus and method of sticking die bonding sheet

A protecting sheet applied to a wafer is removed by using an adhesive tape with a prescribed length, by bonding the adhesive tape to an edge portion of the protecting sheet and then pulling the adhesive tape. During pulling, a guide roller is held in contact with the protecting sheet and, while the guide roller is held in a fixed position, a peeling head portion and a table are moved in the opposite direction with each other to thereby remove the protecting sheet.

Growing community of inventors

Tokyo, Japan

Masaki Tsujimoto