Ebara Corporation

Tdk Corporation

Masaki Tomita

Shao Hua Chang

Masaya Seki

Jumpei Fujikata

Masashi Shimoyama

Kentaro Yamamoto

Yasuyuki Masuda

Kazuhito Tsuji

Takahisa Okuzono

Takashi Watanabe

Ryuji Hashimoto

Mitsutoshi Yahagi

Masashi Ito

Tomoko Kitamura

Junitsu Yamakawa

Mitsuhiro Shamoto

Hideki Takayanagi

Hiroyuki Takenaka

Provided is a technique that can suppress deterioration of plating quality of a substrate due to gas bubbles that remain entirely on a lower surface of a membrane. A plating apparatusincludes a plating tank, a substrate holder, and a membrane module. The membrane module includes a first membraneand a second membrane. The second membrane has an inflow portfor causing a plating solution in a first region Rbelow the second membrane to flow into a second region Rabove the second membrane and below the first membrane, and an inclined portioninclining relative to a horizontal direction and inclining so as to be positioned upward as heading from a center side of an anode chamber to an outer edge side of the anode chamber.

Plating apparatus

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member-having a substrate contact point-for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body-extending above with respect to the substrate contact point-, and attached to the substrate holder; and a contact cleaning memberfor discharging a cleaning liquid toward the main body-of the contact member-from a lower side of the substrate holder.

Plating apparatus and contact cleaning method

A plating module includes: a plating tank, a substrate holder, and an elevating mechanism. The plating tank is for housing a plating solution. The substrate holder is for holding a substrate with a surface to be plated facing downward. The elevating mechanism is for moving up and down the substrate holder. The substrate holder includes: a supporting mechanism, a floating plate, a floating mechanism, and a pushing mechanism. The supporting mechanism is for supporting an outer peripheral portion of the surface of the substrate. The floating plate is arranged on a back surface side of the substrate. The floating mechanism is for biasing the floating plate to a direction away from a back surface of the substrate. The pushing mechanism is for pressing the floating plate to the back surface of the substrate against a biasing force to the substrate by the floating mechanism.

Plating apparatus and substrate holder operation method

Provided is a technique that ensures suppressing deterioration of a plating quality of a substrate caused by gas bubbles accumulating on an entire lower surface of a membrane. A plating process method includes a step of guiding an anode liquid to a second region Rpositioned below a membraneand above a first region Rto decrease a concentration of gas bubbles contained in the anode liquid in the second region below a concentration of gas bubbles contained in the anode liquid in the first region; a step of discharging the anode liquid from the first region; a step of discharging the anode liquid from the second region; a step of supplying a cathode liquid to a cathode chamberin which a substrate Wf is disposed; and a step of flowing electricity between the substrate Wf and an anodeto electroplate a metal on the substrate.

Plating process method

A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tankfor housing a plating solution, an anodearranged in the plating tank, a substrate holderfor holding a substrate Wf with a surface to be plated facing downward, a rotation mechanismfor rotating the substrate holder, and a shielding mechanismmoving a shielding memberbetween the anodeand the substrate Wf depending on a rotation angle of the substrate holder

Plating apparatus and plating method

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

Plating apparatus and substrate cleaning method

Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly. A plating apparatus includes a plating tank configured to house a plating solution, a substrate holder configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, and an elevating mechanism configured to move up and down the substrate holder. The substrate holder includes a supporting mechanismconfigured to support an outer peripheral portion of the surface to be plated Wf-a of the substrate Wf, a back plate assemblyarranged on a back surface side of the surface to be plated Wf-a of the substrate Wf and configured to sandwich the substrate Wf with the supporting mechanism, and a removing mechanismconfigured to provide a force that removes the substrate Wf from the back plate assemblyto a back surface of the surface to be plated Wf-a of the substrate Wf.

Provided is a technique that ensures suppressed invasion of particles generated at a bearing of a rotation mechanism into a plating tank. A plating apparatusincludes a labyrinth seal member. The labyrinth seal member includes an inner labyrinth sealarranged below a bearingto seal the bearing, an outer labyrinth sealarranged outside in a radial direction of the rotation shaftwith respect to the inner labyrinth seal, a delivery portconfigured to supply air to an inner seal spaceformed inside in the radial direction with respect to the inner labyrinth seal, and a suction portconfigured to suction air in an outer seal spaceformed outside in the radial direction with respect to the inner labyrinth seal and inside in the radial direction with respect to the outer labyrinth seal.

A plating apparatusincludes a plating tank, a substrate holder, a rotation mechanism, an elevating mechanism, a contact member, and a cleaning deviceconfigured to clean the contact member. The cleaning deviceincludes a pivot shaft, a first arm, a second arm, and a nozzlethat includes at least one discharge port. Applying a cleaning fluid discharged from the discharge port to the contact membercleans the contact member

Plating apparatus and cleaning method of contact member of plating apparatus

Provided is a technique that allows measuring a film thickness of a substrate in a plating process. A plating apparatusincludes a plating tank, a substrate holder, a rotation mechanism, a plurality of contact members, a coil, a current sensor, and a film thickness measuring device. The plurality of contact membersare disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact memberscontact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coilgenerates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensordetects the current generated in the coil. The film thickness measuring devicemeasures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

Plating apparatus and film thickness measuring method for substrate

An object is to allow for simple measurement of a bump height. There is provided a device for measuring a bump height comprising: a light sensor provided with a light source and a light-receiving element and configured to irradiate a substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer and reflected light that is reflected from the bump, by the light-receiving element; and a control device configured to calculate a height of the bump relative to the seed layer, based on the reflected light from the seed layer and the reflected light from the bump and to subtract an error caused by a refractive index of the resist layer from the height of the bump calculated based on the reflected lights, so as to correct the height of the bump.

Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium

A plating device includes: an anode; a substrate holder which holds a substrate; a substrate contact which comes into contact with a peripheral edge portion of the substrate; a resistor which is disposed in a way of facing the substrate holder between the anode and the substrate holder, and is used for adjusting ion movement; and a rotation driving mechanism which causes the resistor and the substrate holder to relatively rotate. The resistor includes: a shielding region which forms an outer frame and shields the ion movement between the anode and the substrate; and a resistance region which is formed on the radially inner side of the shielding region, and has a porous structure allowing the passage of an ion. An outer diameter of the resistance region has an amplitude centering on an imaginary reference circle, and has a wave shape which is periodic and annularly continuous.

Plating device and resistor

Provided is a substrate holding device that inhibits drop in holding accuracy of a substrate. A Bernoulli chucking pad suctions and holds a front surface or a back surface of a substrate S. A position determineris capable of pushing the substrate S in contact with a side surfaceof the substrate S, and positioning the suctioned substrate S. A pinenables the position determinerto come in contact with the side surfaceof the substrate S. The pinbrings the position determinerinto contact with the side surfaceof the substrate S, and the position determinerthereby positions the substrate S.

Substrate holding device

A permanent magnet including R and T. R are rare earth elements including Sm and at least one selected from Y and Gd. T is Fe alone or Fe and Co. T maybe partly substituted with M, and M is one or more selected from Ti, V, Cr, Mo, W, Zr, Hf, Nb, Ta, Al, Si, Cu, Zn, Ga and Ge. In a total content of R, Sm content is 60 at % or more and 95 at % or less, and a total content of Y and Gd is 5 at % or more and 35 at % or less. The permanent magnet includes main phase crystal grains having a ThMntype crystal structure.

Permanent magnet

There is provided a cleaning device that cleans a substrate holder including a first holding member and a second holding member having an opening for exposing a substrate. This cleaning device includes a cleaning bath configured to house the substrate holder, an actuator configured to separate the second holding member from the first holding member, and a cleaning nozzle configured to discharge a cleaning liquid to the substrate holder housed in the cleaning bath. The cleaning nozzle is configured to pass through the opening of the second holding member.

Growing community of inventors

Tokyo, Japan

Masaki Tomita