Mitsubishi Electric Corporation

Masaki Taya

Kozo Harada

Takashi Nishimura

Hiroyuki Harada

Kei Yamamoto

Kazuhiro Tada

Taichi Obara

Nobuya Nishida

Yo Tanaka

Shinichi Izuo

Hiroki Katsube

Tomohisa Yamane

The power module includes: a heat spreader having a plate shape and having heat conducting property; a semiconductor element at least thermally connected to a one-side surface of the heat spreader; a highly-heat-dissipating insulation adhesive sheet having a plate shape and having a one-side surface thermally connected to an other-side surface of the heat spreader; a metal plate having a one-side surface thermally connected to an other-side surface of the highly-heat-dissipating insulation adhesive sheet; and a sealing resin member sealing the semiconductor element, the heat spreader, the highly-heat-dissipating insulation adhesive sheet, and the metal plate in a state where an other-side surface of the metal plate is exposed, wherein the highly-heat-dissipating insulation adhesive sheet is a complex obtained by impregnating, with a resin, a porous ceramic sintered body in which ceramic particles have a gap and have been integrally sintered.

Power module including highly-heat-dissipating insulation adhesive sheet

An object herein is to provide a bus bar module which is highly reliable in insulation performance, by reducing stresses imposed on its spacer to thereby suppress deterioration in the insulation property thereof. The bus bar module includes: a bus bar having a hole in its parallel planar region and made of an electrically conductive material; a bus bar opposed to the bus bar, having a hole in its parallel planar region and at a position corresponding to the hole, and made of an electrically conductive material; a spacer made of an insulating material, which is sandwiched between the bus bars, and in which a hole is provided so as to overlap with the hole and the hole; and a resin mold covering these bus bars and the spacer; wherein a through-hole that is established by the holes, is filled with a portion of the resin mold.

Bus bar module

A power module will be provided which can suppress insulation performance deterioration caused by heat cycle to ensure insulation performance, by suppressing generation of bubbles and occurrence of detachments between silicone gel and an insulating substrate at a high or low temperature or at a high working voltage. The power module includes: an insulating substrateon a first face of which a semiconductor elementis provided; a base platejoined to a second face of the insulating substrate; a case membersurrounding the insulating substrateand being in contact with a face of the base plate, that is joined to the insulating place; sealing resinfilling a region surrounded by the base plateand the case memberto seal the insulating substrate; a pressing platedisposed in close contact with a surface of the sealing resinin a side of the first face of the insulating substrate; and a lid memberfacing an opposite face of the pressing platewith respect to a face thereof in close contact with the sealing resin, and being fixed to the case memberat a position to prevent the pressing platefrom ascending.

Power module

A power module that can realize insulation performance by suppressing the occurrence of bubbles in silicone gel and the detachment between the silicone gel and an insulating substrate during high temperature, during low temperature and during low atmospheric pressure, to thereby suppress degradation of insulation performance. The power module includes: an insulating substrate having a front surface on which a power semiconductor element is mounted; a base plate joined to a back surface of the insulating substrate; a case fixed to the base plate and surrounding the insulating substrate; a cover fixed to the case and forming a sealed region; and a silicone gel serving as a filling member filling the entire sealed region and having internal stress maintained at compressive stress.

Power module and method of manufacturing the same

A semiconductor device includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member that surrounds the insulating substrate and that is in contact with a surface of the base plate to which the insulating substrate is joined; a sealing resin provided in a region surrounded by the base plate and the case member; a cover member facing a surface of the sealing resin and fixed to the case member; and a holding plate, a lower surface of the holding plate and a portion of a side surface of the holding plate being in close contact with the surface of the sealing resin, an upper surface of the holding plate being fixed to and protruding from a surface of the cover member facing the surface of the sealing resin.

Semiconductor device and method for manufacturing same

The power module includes: an insulating substrate having an upper surface on which a semiconductor element is mounted; a base plate joined to a lower surface of the insulating substrate; a case member surrounding the insulating substrate and adhered to the base plate; a sealing resin provided in a region surrounded by the base plate and the case member, so as to seal the insulating substrate; and a holding plate projecting from an inner wall of the case member to above an outer peripheral portion of the insulating substrate, the holding plate being fixed to the inner wall, the holding plate being in contact with the sealing resin.

A power module includes: a plurality of partition wall plates that are provided in a case and form a trench; a plurality of relay terminals whose electric potentials are different, that are formed so that the plurality of partition wall plates are positioned therebetween and that are formed to be opposed with each other; a printed circuit board to which the plurality of relay terminals is connected and which is provided with a slit at a position opposing the trench; and a shielding plate that is placed so that one end portion of the shielding plate is positioned in the trench, and so that an amount by which the other end portion thereof protrudes from the slit is larger than amounts by which the relay terminals protrude from the printed circuit board. The power module ensures insulation inside the power module.

A power module providing an improved manufacture yield and having an ensured stable joint strength and accordingly improved reliability is provided. The power module includes: a base portion having one surface on which an electrode portion is formed; a conductor portion disposed to face the one surface of the base portion on which the electrode portion is formed, for making electrical connection with the outside; and an interconnect portion connected to the electrode portion formed on the one surface of the base portion and to the surface of the conductor portion facing the one surface of the base portion for electrically connecting the electrode portion to the conductor portion.

Power module and method of manufacturing power module

In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.

Growing community of inventors

Chiyoda-ku, Japan

Masaki Taya