Murata Manufacturing Co., Ltd.

Masaki Tada

Syunsuke Kido

Atsushi Ono

Masanori Kato

Hiroshi Matsubara

Mitsunori Samata

Yukiteru Sugaya

Isao Takenaka

Keisuke Nishio

In a radio-frequency module, a hybrid filter includes an acoustic wave filter including at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor. A plurality of outer electrodes of the acoustic wave filter includes a first input and output electrode connected to a first signal terminal, a second input and output electrode connected to a second signal terminal, and a ground electrode connected to a ground terminal. The inductor is disposed on a first major surface of a mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate. When viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and ground electrode.

Radio-frequency module and communication device

A power amplifier module includes a first transistor that amplifies and outputs a signal, a second transistor that supplies a bias current to a base of the first transistor, and a ballast resistor circuit that is disposed between the base and an emitter of the second transistor and that includes first and second resistive elements and a switching element. The first resistive element is arranged in series on a line connecting the base and the emitter. The first and second resistive elements are series-connected or parallel-connected. When the second resistive element is series-connected to the first transistor, the switching element is parallel-connected to the second resistive element. When the second resistive element is parallel-connected to the first transistor, the switching element is series-connected to the second resistive element. The switching element is switched on/off based on a collector current of the second transistor.

Power amplifier module

A radio frequency module includes: a power amplifier; an inductor connected to the power amplifier; an external connection terminal that is connected to the power amplifier via the inductor and is configured to receive a power supply voltage from an outside source; a low-noise amplifier; a matching circuit connected to input of the low-noise amplifier; and a module substrate including a first principal surface and a second principal surface on opposite sides of the module substrate. The inductor is disposed on one of the first principal surface and the second principal surface, and the matching circuit is disposed on the other of the first principal surface and the second principal surface.

Radio frequency module and communication device

A radio frequency module includes: a plurality of external connection terminals including at least one input terminal and at least one output terminal; at least one power amplifier; at least one low-noise amplifier; a first switch connected between the at least one input terminal and the at least one power amplifier; a second switch connected between the at least one output terminal and the at least one low-noise amplifier; and a module substrate including a first principal surface and a second principal surface on opposite sides of the module substrate. The first switch is disposed on one of the first principal surface and the second principal surface, and the second switch is disposed on the other of the first principal surface and the second principal surface.

A radio-frequency module includes a module substrate having a first principal surface and a second principal surface on opposite sides of the module substrate, a power amplifier capable of amplifying a transmission signal, a low-noise amplifier capable of amplifying a reception signal, a first switch connected to an input terminal of the power amplifier and disposed on the second principal surface, a second switch connected to an output terminal of the low-noise amplifier and disposed on the second principal surface, and a first ground terminal disposed in a region that is on the second principal surface and that is between the first switch and the second switch in plan view of the module substrate.

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Nagaokakyo, Japan

Masaki Tada