Renesas Electronics Corporation

Konica Corporation

Mazda Motor Corporation

Nippon Steel Chemical & Material Co., Ltd.

Nippon Graphite Fiber Corporation

Nippon Steel Composite Co., Ltd.

Masaki Shimada

Kan Takeuchi

Shinya Konishi

Fumio Tsuchiya

Daisuke Oshida

Yoshio Takazawa

Naoya Ota

Yutaka Arai

Masashi Saito

Kazuhiro Sugiyama

Yasushi Hoshino

Masanori Honda

Takeshi Okagaki

Kiyotaka Murakami

Mitsuru Watanabe

Katsuya Himuro

Kenji Nishida

Koichi Hattori

Yoshitaka Ohta

Toshikazu Takeda

Tetsuya Sugiyama

Toshimitsu Harada

Masaki Arazoe

Hironobu Takahama

Koichi Horigome

Takashi Terauchi

Hidehiko Hino

A semiconductor device according to an embodiment includes a holding circuit including a buffer configured to obtain a heat stress information having a temperature dependency every predetermined period and a stress counter configured to accumulate the heat stress information and hold the accumulated value as a cumulative stress count value, a control circuit including an operation determination threshold value, and a wireless communication circuit. According to the semiconductor device according to the embodiment, while reducing the power consumption, it is possible to wirelessly transmit the cumulative heat stress information.

Semiconductor device, electronic device and electronic system

An object of the present invention is to provide a technique of duplexing monitor circuits in which a common cause failure can be eliminated. A semiconductor device has: a first monitor circuit monitoring that temperature or voltage of the semiconductor device is within a normal operation range; and a second monitor circuit monitoring normal operation of the first monitor circuit. The first and second monitor circuits generate information of temperature or voltage on the basis of different principles.

Semiconductor device and semiconductor system

The semiconductor device has a module having a predetermined function, an error information acquisition circuit for acquiring error information about an error occurring in the module, a stress acquisition circuit for acquiring a stress accumulated value as an accumulated value of stress applied to the semiconductor device, and an analysis data storage for storing analysis data as data for analyzing the state of the semiconductor device, the error information and the stress accumulated value at the time of occurrence of the error being associated with each other.

Semiconductor device and analysis system

To provide prepreg having high thermostability and a molded body (fiber reinforced composite) obtained from the prepreg, the prepreg is formed by impregnating a reinforced fiber having an elastic modulus of 100 to 900 GPa with an epoxy resin composition including the following Components A to D so as to have a resin content within a range of 25 to 50 mass %: Component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; Component B: an epoxy resin that is liquid at 30&#xb0; C.; Component C: a diblock copolymer having a B-M structure, wherein M is a block including at least 50 mass % of methyl methacrylate, B is a block immiscible with the epoxy resins and the block M, a glass transition temperature of the block B being 20&#xb0; C. or lower; and Component D: dicyandiamide, or an amine curing agent that is a derivative of dicyandiamide.

Prepreg and molding product thereof

There is to provide a semiconductor device capable of predicting a wear-out failure based on the degradation stress cumulative amount of power supply voltage and environmental temperature imposed on the device, which includes a ring oscillator having a plurality of stages of inverters, and a control circuit that emphasizes the voltage dependency and temperature dependency of an oscillation frequency of the ring oscillator or a control circuit that emphasizes the temperature dependency not the voltage dependency.

Semiconductor device

An object of the invention is to provide a semiconductor apparatus capable of achieving conditions that are stricter than the conditions in which the stable operation is guaranteed, without increasing the circuit size. A semiconductor apparatus () includes a semiconductor circuit (); a voltage generator () that selects one of at least two types of voltages and applies a power supply voltage, the at least two types of voltages including a normal voltage at which the semiconductor circuit () normally operates and a low voltage which is lower than the normal voltage; and a clock generator () that supplies the semiconductor circuit () with a clock signal having a constant frequency regardless of the power supply voltage.

Semiconductor apparatus and system

It is an object of the present invention to provide round fiber-reinforced plastic strand, a manufacturing method thereof, and a fiber-reinforced sheet which eliminate limitation in forming speed and limit on number of products capable of being manufactured at a time, do not require use of a release agent, eliminate the necessity of operations such as roughing after forming, and thus permit a considerable reduction of the manufacturing cost and a remarkable increase in the product quality. The manufacturing method of the round fiber-reinforced plastic strand of the present invention comprises (a) a step of continuously feeding reinforcing fiber bundles feach comprising a plurality of reinforcing fibers arranged in a direction while twisting the reinforcing fiber bundles f(b) a step of impregnating the reinforcing fiber bundles ffed continuously with a matrix resin R; and (c) a step of heating the resin-impregnated reinforcing fiber bundles fwhile tensioning to a prescribed intensity, thereby forming the reinforcing fiber bundle into a circular cross-section and hardening the resin, and manufactures a fiber-reinforced plastic strandhaving a circular cross-section.

Round fiber-reinforced plastic strand, manufacturing method thereof, and fiber-reinforced sheet

The present invention concerns a data-storing device, which is coupled to a personal computer through an interface and can enlarge a number of and a kind of devices connectable to the personal computer. The data-storing device includes an interfacing circuit that includes a data communication path through which the data can be bilaterally communicated between the device and an external device, which is coupled to the device with an interface cable, and a power-supplying path through which a power current can be bilaterally supplied between the device and the external device, wherein the interface cable also includes the data communication path and the power-supplying path; a data-storing unit to store the data sent from the interfacing circuit; and a plurality of interface connecting ports serving as input/output terminals of the interfacing circuit, wherein the interface cable can be connected to one of the interface connecting ports.

Data-storing device

A video camera, capable of being connected with a computer, for photographing animated images. The video camera includes: a camera main body for outputting image signals corresponding to the animated images; and a memory adapter, detachable from the video camera, for recording one of the animated images as a still picture. The memory adapter also sends back the image signals, corresponding to the still picture, to the video camera so that the video camera outputs the image signals corresponding to the still picture.

Video camera for photographing animated images

A silver halide type camera wherein an optical image of a subject focused on a silver halide film is received by a charge coupled device, an image information from the charge coupled device is processed by a signal processing device and displayed on a display, and a photographing condition is changed according to the image on the display immediately before taking a picture to form an optimum picture on the silver halide film. The camera has a photographing condition input device, an operating device for generating a start signal for reproducing and displaying the image, a memory device for storing the image information signal, an image information transfer device for transferring to the memory device the image information signal which is generated within a predetermined time by the signal processing device, and a control device for actuating the image information transfer device on the basis of the photographing condition applied from the photographing condition input device when the start signal is generated by the operating device.

Silver halide film type camera

Growing community of inventors

Tokyo, Japan

Masaki Shimada