Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Masaki Seguchi

Kyohei Ishikawa

Naoyuki Nakamura

Tatsuya Yamamoto

Kenta Fujii

Shuichi Fujikawa

Motoaki Nishiwaki

Junichi Nishimae

Hiroyuki Murai

Takashi Yamamoto

Nobuaki Tanaka

Daiji Morita

Akinori Nishio

Tomotaka Katsura

Akira Ishimori

Kazuki Kuba

Teruaki Fukuoka

Yoshiharu Kurosaki

Keisuke Furuta

Hideyuki Masui

Kenji Saruta

Takafumi Kawai

A laser machine includes a housing, a machining table, a gate, a machining head, a loading/unloading door, an exhaust port, an outside air intake port, and a deflector. The housing includes a first face and a second face orthogonal to a first direction, a third face and a fourth face orthogonal to a second direction, and a fifth face orthogonal to a third direction and facing the floor surface. The exhaust port is provided on the second face and connected to an exhaust unit that generates an airflow that is a flow of air inside the housing. The outside air intake port is provided in an upper part of the housing between the first face and the machining head in the first direction, and takes in outside air. The deflector guides the outside air introduced through the outside air intake port toward the machining head.

Laser machine

A laser processing apparatus includes a laser oscillator; a processing head; a driver that controls a relative positional relationship between a workpiece and the processing head; control circuitry that controls the laser oscillator and the driver in order for the laser beam to scan a processing path on the workpiece; detection circuitry that observes a state of the workpiece being processed and outputs a result of observation as a time series signal; processed state observation circuitry that obtains evaluation information including a determination result that indicates whether a processed state of the workpiece is satisfactory or defective by evaluating the processed state of the workpiece on the basis of the time series signal for each of a plurality of sections obtained by dividing the processing path; and estimation circuitry that estimates a cause of a defect on the basis of the evaluation information of two or more of the sections.

Laser processing apparatus

A machining condition search device according to the disclosure includes a machining condition generation unit, a practical machining command unit, a machining evaluation unit, a prediction unit, an optimum machining condition calculation unit. The machining condition generation unit generates a machining condition defined by one or more control parameters settable on a machining apparatus. The practical machining command unit causes the machining apparatus to perform machining based on a generated machining condition. The machining evaluation unit generates an evaluation value of performed machining, on the basis of information indicating a machining result of the performed machining. The prediction unit predicts an evaluation value corresponding to a machining condition under which machining is not performed, on the basis of the evaluation value and the machining condition corresponding to the evaluation value. The optimum machining condition calculation unit obtains an optimum machining condition on the basis of a prediction value predicted by the prediction unit and an evaluation value generated by the machining evaluation unit. The optimum machining condition is a machining condition under which an evaluation value is equal to or greater than a threshold and a tolerance is maximum.

Machining condition search device and machining condition search method

A machining failure detection device includes a machining light measurement unit that measures machining light generated at a machining point during machining; a machining sound measurement unit that measures machining sound generated at the machining point; and a computation unit that determines whether a machining failure has occurred in the machining. The computation unit includes a feature extraction unit, a determination value calculation unit, and a determination unit. The feature extraction unit extracts a machining light feature from a machining light signal measured by the machining light measurement unit, and extracts a machining sound feature from a machining sound signal measured by the machining sound measurement unit. The determination value calculation unit calculates a combined failure determination value on the basis of the machining light feature and the machining sound feature. The determination unit compares the combined failure determination value with a determination criterion to determine a failure.

Machining failure detection device, laser cutting apparatus, and electric discharge machining apparatus

A laser machining apparatus includes: a laser oscillator to emit a laser beam; a focusing lens to irradiate a workpiece with the laser beam; a focus position control mechanism disposed between the laser oscillator and the focusing lens and disposed on the optical path of the laser beam and that controls the divergence angle of the laser beam and the incident diameter of the laser beam incident on the focusing lens; a laser beam deflector to deflect the laser beam before the laser beam is incident on the focusing lens; and an emitting angle control mechanism to control the emitting angle of the laser beam that exits from the focusing lens after being deflected by the laser beam deflector.

Laser machining apparatus and laser machining method

A laser machining apparatus includes: a laser oscillator that emits laser light having a plurality of wavelengths; a transmission diffractive optical element that allows the laser light to pass therethrough; a machining lens that concentrates the laser light that has passed through the transmission diffractive optical element; a distance adjustment mechanism that changes a distance between the transmission diffractive optical element and the machining lens; and an angle adjustment mechanism that changes an angle of the transmission diffractive optical element to switch between a state in which the laser light is dispersed by the transmission diffractive optical element and then enters the machining lens and a state in which the laser light enters the machining lens without being dispersed by the transmission diffractive optical element.

Laser machining head and laser machining apparatus

A laser processing device including: a laser oscillator; a processing table; a transmission optical system for transmitting laser light emitted from the laser oscillator to the processing table; a processing head for condensing and radiating the laser light transmitted via the transmission optical system to an object to be processed; a moving mechanism for changing a relative position between the object to be processed and the laser light to be radiated to the object to be processed; and a variable curvature spherical mirror. The transmission optical system includes a reflective beam expander mechanism for collimating and magnifying the laser light from the laser oscillator. The reflective beam expander mechanism includes a spherical mirror and a concave mirror having different curvatures in two orthogonal axes.

Laser processing device

A laser oscillator includes a light condensing block having a through-hole for housing a laser medium, and an aperture for introducing excitation light from an excitation light source module into the through-hole; an end plate fixed to an end of the light condensing block, in which a cooling water channel for leading cooling water to the light condensing block and a cooling water channel for leading cooling water to the excitation light source module are formed; and a flow tube fixed and sealed by the end plate, for forming a cooling water passage for the laser medium; and an excitation light source module in which a cooling water channel, communicating with the water channel for the excitation light source module in the end plate, is formed for cooling its excitation light source.

Laser beam transmitter

A solid state laser apparatus and a laser machining apparatus are provided to provide high power laser beam having an excellent condensing performance at high efficiency and with high reliability. In the solid state laser apparatus, a recess is provided in a supporter disposed on a slab side surface at an excitation area corresponding portion. A high reflectance body having a cooling water filtrating groove is disposed in the recess to contact with a slab facing surface with pressure. The supporter contacts slab longitudinal both ends with pressure through a silicon rubber plate which is transparent to excitation light. A transparent silicon rubber O-ring is disposed to extend over an entire peripheral portion of a plane formed by a slab surface including the supporter pressure contacting porting and the supporter so as to seal cooling water and elastically support the slab.

Growing community of inventors

Tokyo, Japan

Masaki Seguchi