Kabushiki Kaisha Toshiba

Masaki Satake

Satoshi Tanaka

Kazuya Fukuhara

Shoji Mimotogi

Takashi Sato

Toshiya Kotani

Hiromitsu Mashita

Tatsuhiko Higashiki

Akiko Mimotogi

Yosuke Kitamura

In a model-based OPC which makes a suitable mask correction for each mask pattern using an optical image intensity simulator, a mask pattern is divided into subregions and the model of optical image intensity simulation is changed according to the contents of the pattern in each subregion. When the minimum dimensions of the mask pattern are smaller than a specific threshold value set near the exposure wavelength, the region is calculated using a high-accuracy model and the other regions are calculated using a high-speed model.

Mask pattern correcting method

A projection exposure method that projects the shape of a hole onto a wafer by projecting a diffracted light, which is produced by applying light to a mask having a pattern for forming a hole pattern, onto the wafer through a projection optical system for exposure, wherein, in a plane substantially perpendicular to an optical axis, the light applied to the mask has a first intensity distribution in which the intensity is higher in the vicinity of eight apexes of an octagon centered at the optical axis than in other areas, the mask has a plurality of first opening patterns are arranged in a rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis, and a plurality of second opening patterns are arranged in a face-centered rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis.

Projection exposure method

A pattern prediction method according to an embodiment includes: predicting a second pattern shape from a first pattern shape by using a conversion function and a conversion difference residual error amount function, wherein; the conversion function makes the connection between the first pattern formed by a first step and the second pattern formed by a second step following the first step based on contour shapes of the first pattern and the second pattern, and the conversion difference residual error amount function makes the connection between a residual error amount between a predicted shape of the second pattern obtained from the conversion function and the second pattern shape obtained by actually using the second step, and factors other than the contour shapes of the first pattern and the second pattern.

Pattern prediction method, pattern correction method, semiconductor device, and recording medium

A lithography simulation method of obtaining a resist image by a simulation using a first function and a second function, the lithography simulation method comprising: determining a mask transmission function from a mask layout, modulating the mask transmission function using the first function to determine a modulated mask transmission function, obtaining an optical image of the mask layout using the modulated mask transmission function, and applying the second function to the optical image to obtain the resist image of the mask layout.

Lithography simulation method, method of manufacturing a semiconductor device and program

A method of creating a simulation model, includes acquiring a CD value of a photoresist pattern actually formed based upon a test pattern, acquiring information about a shape of the photoresist pattern, acquiring an intensity distribution of an optical image based upon the test pattern by performing simulation, acquiring an empirical threshold defined according to a CD value on the intensity distribution, which corresponds to the CD value of the photoresist pattern, acquiring a parameter of the optical image based upon the intensity distribution of the optical image, acquiring a first correlation between the information about the shape of the photoresist pattern and the parameter of the optical image, acquiring a second correlation between the information about the shape of the photoresist pattern and the empirical threshold, and acquiring a third correlation between the parameter of the optical image and the empirical threshold by using first and second correlations.

Creating method of simulation model, manufacturing method of photo mask, manufacturing method of semiconductor device, and recording medium

A lithography simulation method which predicts the result that a pattern formed on a mask is transferred onto a sample by use of a simulation based on pattern data of the mask includes subjecting a mask layout containing a pattern whose periodicity is disturbed to the simulation. At this time, a calculation area of pattern data used for the simulation is set to an integral multiple of minimum periodic length of the mask layout.

Lithography simulation method, program and semiconductor device manufacturing method

A lithography simulation method includes obtaining a mask transmission function from a mask layout, obtaining an optical image of the mask layout by using the mask transmission function, obtaining a function which is filtered by applying a predetermined function filter to the mask transmission function, and correcting the optical image by using the filtered function.

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Yokohama, Japan

Masaki Satake