Nitto-denko Corporation

Masaki Sakata

Masayuki Yamamoto

Takao Matsushita

An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof. The separated semiconductor wafer and support board are collected independently.

Support board separating apparatus, and support board separating method using the same

A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.

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Mie-ken, Japan

Masaki Sakata