Other

Masaki Sakaguchi

Hideharu Sakoda

Muneharu Morioka

Toshiyuki Motooka

Mamoru Suwa

Mitsuyoshi Imai

Hideki Toya

Naoki Yamabe

Akihiko Tanaka

Takashi Kamezawa

To provide a constant voltage DC supply device capable of supplying a direct current at a predetermined voltage for a long time irrespective of characteristics of a storage battery and the like. The constant voltage DC supply device for supplying a direct current at a predetermined voltage from a specific power generation unit, including: a plurality of power storage units; a drive unitsthat is connected to the power storage units and rotating/driving by power supplied from any one of the power storage units; a plurality of the power generation unitsconnected to the drive units, respectively, and generating power by driving of the drive units; and a control unitfor controlling connection between the plurality of power storage units and the driving unit and between the power generation units other than the specific power generation unitand the power storage units, in which wherein the control unit executes control such that, when a voltage of the power storage unit supplying the power to the drive unit falls to a first voltage or less, the power is supplied from the power storage unit other than power storage part and to charge at least one power storage part other than that power storage unit is charged.

Constant voltage DC supply device

In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.

Resin for semiconductor wire

In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess

Carrier substrate for producing semiconductor device

Growing community of inventors

Nagano, Japan

Masaki Sakaguchi