Kyocera Corporation

Masaki Nambu

Hiroyuki Tanaka

Takanori Ikuta

Daisuke Makibuchi

Masaru Nagata

Yasutaka Ohashi

Yusuke Morimoto

Toshiki Matsuoka

Toshiya Kimura

A surface acoustic wave (SAW) device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode located on an upper surface of the piezoelectric substrate, a cover covering the upper surface of the piezoelectric substrate from above the IDT electrode, at least one first via conductor extending through at least part of the cover from the upper surface of the piezoelectric substrate to an upper surface of the cover, at least one second via conductor located, on the piezoelectric substrate, inward from the first via conductor in a plan view, extending through at least part of the cover from the upper surface of the piezoelectric substrate to the upper surface of the cover, and having a smaller diameter than the first via conductor, and a conductive layer located on the upper surface of the cover and extending over an upper end of the second via conductor.

Elastic wave device, duplexer, and communication device

A SAW device includes a piezoelectric substrate, a support substrate which is located on a lower surface of the piezoelectric substrate and has a smaller thermal expansion coefficient than that of the piezoelectric substrate, an IDT electrode located on the piezoelectric substrate, a cover forming a space above the IDT electrode, and a plurality of first strip conductors which extend alongside each other on the cover and at least a part of which overlaps the space when viewed on a plane.

Acoustic wave device, multiplexer, and communication apparatus

An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.

Electronic component and acoustic wave device

Growing community of inventors

Katano, Japan

Masaki Nambu