Toray Engineering Company, Limited

Masaki Mori

Masamichi Yamashita

Takayoshi Fujimoto

Hiroyuki Nakagawa

Takuya Onji

Yutaka Oka

A light conversion member includes a light conversion film, a first gas barrier, and a first base material. The light conversion film converts color of light from a specific color. The first gas barrier is located on a side of the light conversion film where the light to be converted is incident. The first gas barrier includes one or more gas barrier layers that prevent moisture and gas from entering the light conversion film. The first base material is located on an opposite side of the first gas barrier from a face on which the light conversion film is located. The first base material transmits the light and holds the light conversion film and the first gas barrier. For a light of the specific color, a light transmittance of the first base material combined with the first gas barrier is higher than a light transmittance of the first base material alone.

Light conversion member

A method for forming a sealing film, in which a buffer layer and a barrier layer whose density is higher than that of the buffer layer are alternately formed on a substrate, includes forming a first buffer layer on a surface of the substrate, forming a first barrier layer on a surface of the first buffer layer, and forming a second buffer layer on a surface of the first barrier layer. A ratio of a thickness of a portion of the first buffer layer in a thickness direction of the substrate relative to a thickness of a portion of the first buffer layer in an inclined direction that is inclined with respect to the thickness direction is closer to 1 than a ratio of a thickness of a portion of the second buffer layer in the thickness direction relative to a thickness of a portion of the second buffer layer in the inclined direction.

Method for forming sealing film, and sealing film

In an LED module, modes to solve such a problem that a loss in the output of light discharged into the atmosphere occurs are embodied. Specifically, in an LED module in which an LED chip is sealed with a sealing resin, a surface of the sealing resin is covered with a thin film, the thin film is made of a material having a smaller linear expansion coefficient than the sealing resin, and an irregular surface is provided on a surface of the thin film such that light from the LED chip is multiply reflected.

LED module and method for manufacturing LED module

A laser exposure apparatus including a laser oscillator ( ) for oscillating laser beam having a circular section, a beam expander ( ) for enlarging the laser beam oscillated from the laser oscillator, a square mask ( ) for shaping the laser beam having the circular section enlarged by the beam expander into a square section and an optical system for contracting the laser beam formed into the square section by the square mask. Even when a very small identification code is attached to a wafer, the identification code can be marked to improve reading recognizability of the identification code.

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Yasu, Japan

Masaki Mori