Nitto-Denko Corporation

Other

Amkor Technology, Inc.

Masaki Mizutani

Takeshi Matsumura

Sadahito Misumi

Hirofumi Fujii

Hiroshi Noro

Satoshi Ito

Toshikazu Baba

Makoto Kuwamura

Hirotaka Ueda

Atsushi Yasui

Yoshihiro Kawamura

Shou Takarada

Takashi Fukushima

Kyouyuu Jo

Shinichiro Sudo

Katsutoshi Hirashima

The optical film with a pressure sensitive adhesive on both sides includes a first pressure sensitive adhesive layer having a thickness of 3 &#x3bc;m to 30 &#x3bc;m on first main surface of an optical film, and a second pressure sensitive adhesive layer having a thickness of 50 &#x3bc;m or more on second main surface of the optical film. A first protective sheet and a second protective sheet are releasably attached on the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer, respectively. The residual stress of the second pressure sensitive adhesive layer S(N/cm), the thickness of the first protective sheet Y (&#x3bc;m); and the thickness of the second protective sheet Z (&#x3bc;m) satisfy the following relationship: 20&#x2266;Y&#x2266;80; 45&#x2266;Z; and Y+0.17 Z+10.6 S&#x2267;63.

Optical film with pressure sensitive adhesive on both sides and method for producing image display device using thereof, and method for suppressing curl of optical film with pressure sensitive adhesive on both sides

A photosensitive resin composition contains a component (A) and at least one of a component (B) and a component (C). In addition, in the circuit board with metal support including: a metal support; a base insulating layer; a conductive layer formed of a wiring circuit pattern; and a cover insulating layer, at least one of the above-mentioned base insulating layer and cover insulating layer is made of the above-mentioned photosensitive resin composition. where Rrepresents an alkyl group having 1 to 3 carbon atoms; and Rand Reach represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms and may be identical to or different from each other;

Photosensitive resin composition and circuit board with metal support using the same

A dicing/die-bonding film including a pressure-sensitive adhesive layer () on a supporting base material () and a die-bonding adhesive layer () on the pressure-sensitive adhesive layer (), wherein a releasability in an interface between the pressure-sensitive adhesive layer () and the die-bonding adhesive layer () is different between an interface (A) corresponding to a work-attaching region () in the die-bonding adhesive layer () and an interface (B) corresponding to a part or a whole of the other region (), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

A suspension board with circuit includes a gimbal portion. The gimbal portion includes a tongue portion formed at the inner side of the opening for being mounted with a slider mounted with a magnetic head for being electrically connected to the conductive layer, an outrigger portion formed at the outer side of the opening to support the tongue portion, and a passing portion passing through the opening of the gimbal portion and/or an outer side region of the outrigger portion. The passing portion includes the conductive layer and the insulating layer covering the conductive layer. The thickness of a lower half portion of the insulating layer in the passing portion is the same as that of an upper half portion thereof.

Suspension board with circuit and producing method thereof

A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260&#xb0; C. after being cured.

Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method

A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1): 

The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer () on a substrate material () and a die-bonding adhesive layer () on the pressure-sensitive adhesive layer (), wherein the adhesion of the pressure-sensitive adhesive layer () to the die-bonding adhesive layer (), as determined under the conditions of a peel angle of 15&#xb0; and a peel point moving rate of 2.5 mm/sec. at 23&#xb0; C., is different between a region () corresponding to a work attachment region () and a region () corresponding to a part or the whole of the other region (), in the die-bonding adhesive layer (), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer ()&#x3c;adhesion of the pressure-sensitive adhesive layer (), and the adhesion of the pressure-sensitive adhesive layer () to the die-bonding adhesive layer () is not higher than 2.3 N/25 mm.

Dicing die-bonding film

A conductor circuit () having a predetermined pattern is formed on a base material (); a photosensitive resin composition layer is formed on a surface of the base material, on which the conductor circuit () having the predetermined pattern is formed, by using a photosensitive resin composition; a surface of the photosensitive resin composition layer is irradiated with and exposed to active light rays through a photomask having a predetermined pattern; a solder resist layer () having a predetermined pattern is formed by using a developing solution; and the formed solder resist layer () is irradiated with ultraviolet light by using a low-pressure mercury-vapor lamp.

Method of manufacturing wiring circuit board

A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises: (A) a cyclic phosphazene compound represented by the following general formula (1): wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5: wherein Ris a hydrogen atom or a methyl group;(B) a carboxyl-containing linear polymer obtained by polymerizing an ethylenically unsaturated compound through addition polymerization;(C) an epoxy resin;(D) an ethylenically unsaturated group-containing polymerizable compound; and(E) a photopolymerization initiator;wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.

Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition

The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer () on a substrate material () and a die-bonding adhesive layer () on the pressure-sensitive adhesive layer (), wherein the adhesion of the pressure-sensitive adhesive layer () to the die-bonding adhesive layer (), as determined under the conditions of a peel angle of 15&#xb0; and a peel point moving rate of 2.5 mm/sec. at 23&#xb0; C., is different between a region () corresponding to a work attachment region () and a region () corresponding to a part or the whole of the other region (), in the die-bonding adhesive layer (), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer () &#x3c;adhesion of the pressure-sensitive adhesive layer (), and the adhesion of the pressure-sensitive adhesive layer () to the die-bonding adhesive layer () is not higher than 2.3 N/25 mm.

The dicing die-bonding film of this invention comprises a pressure-sensitive adhesive layer () on a supporting base material () and a die-bonding adhesive layer () on the pressure-sensitive adhesive layer (), wherein a releasability in an interface between the pressure-sensitive adhesive layer () and the die-bonding adhesive layer () is different between an interface (A) corresponding to a work-attaching region () in the die-bonding adhesive layer () and an interface (B) corresponding to a part or the whole of the other region (), and the releasability of the interface (A) is higher than the releasability of the interface (B). According to this invention, there can be provided a dicing die-bonding film excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

Dicing die-bonding film, method of fixing chipped work and semiconductor device

The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer () on a substrate material () and a die-bonding adhesive layer () on the pressure-sensitive adhesive layer (), wherein the adhesion of the pressure-sensitive adhesive layer () to the die-bonding adhesive layer (), as determined under the conditions of a peel angle of 15&#xb0; and a peel point moving rate of 2.5 mm/sec. at 23&#xb0; C., is different between a region () corresponding to a work attachment region () and a region () corresponding to a part or the whole of the other region (), in the die-bonding adhesive layer (), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer ()&#x3c;adhesion of the pressure-sensitive adhesive layer (), and the adhesion of the pressure-sensitive adhesive layer () to the die-bonding adhesive layer () is not higher than 2.3 N/25 mm. There is thus provided the dicing die-bonding film that is excellent in balance between retention during dicing of the thin work and releasability of its diced chipped work together with the die-bonding adhesive layer, even if a work is thin.

The dicing die-bonding film of this invention comprises a pressure-sensitive adhesive layer on a supporting base material and a die-bonding adhesive layer on the pressure-sensitive adhesive layer, wherein a releasability in an interface between the pressure-sensitive adhesive layer and the die-bonding adhesive layer is different between an interface corresponding to a work-attaching region in the die-bonding adhesive layer and an interface corresponding to a part or the whole of the other region, and the releasability of the interface is higher than the releasability of the interface. According to this invention, there can be provided a dicing die-bonding film excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

Growing community of inventors

Ibaraki, Japan

Masaki Mizutani