Eneos Corporation

Nippon Oil Company

Nippon Mitsubishi Oil Corporation

Subaru Corporation

Jx Nippon Oil Energy Corporation

Jxtg Nippon Oil & Energy Corporation

Kabushiki Kaisha Toshiba

Fuji Jukogyo Kabushiki Kaisha

Yokogawa Electric Corporation

Nagoya Institute of Technology

Internode Inc

Masaki Minami

Keizo Ikai

Yoshinori Nishitani

Mitsuo Matsuno

Tatsuki Sato

Takayuki Matsumoto

Yoshinori Nishikitani

Naoyuki Sekine

Yoshihiro Fukuda

Masanori Nakajima

Masaaki Kobayashi

Takaya Kubo

Iwane Shiozaki

Hiroshi Imafuku

Keizo Iaki

Noboru Takaesu

Kenichi Nagami

Tsuyoshi Asano

Tsutomu Nakamura

Masaaki Yonezawa

Kazuya Kubo

Jun Murai

Hideki Masuda

Takeo Kuwabara

Tetsuo Hoshi

Ayumu Komata

Noriyo Yamanaka

Joji Murakami

Masahiro Ibaragi

Zhengzhe Jin

Tsutomu Sano

Tuyoshi Asano

The invention provides a curable resin composition excellent in curability at low temperature for obtaining a cured product high in heat resistance, a cured product thereof, and methods of producing the curable resin composition and the cured product. Also provided is a semiconductor device using the cured product as a sealant. In particular, the invention provides a curable resin composition comprising (A) a benzoxazine compound represented by a structure of formula (1), (B) an epoxy compound, and (C) a phenol-based curing agent, wherein a number of epoxy groups in the epoxy compound (B), a number of benzoxazine rings in the benzoxazine compound (A), and a number of hydroxyl groups in the phenol-based curing agent (C) satisfy formula (2), and a ratio of the benzoxazine equivalent in the benzoxazine compound (A) to the hydroxyl group equivalent in the phenol-based curing agent (C) is 1.1 to 8.0.

Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

Provided is a curable resin composition being excellent in normal-temperature stability for obtaining cured product having high heat resistance, cured product thereof, methods of producing the composition and the product, and a semiconductor device using the product as sealant. Further provided is a resin composition, cured product thereof, and methods of producing the composition and the product, wherein the composition includes: (A) multifunctional benzoxazine compound having at least two benzoxazine rings, (B) epoxy compound containing at least one epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) curing agent; wherein composition consisting of (A), (B), and (C) has weight-average molecular weight of 350 or more and 650 or less in terms of polystyrene. Additionally provided is a semiconductor device where semiconductor element is disposed in the cured product obtained by curing the composition containing components (A) to (C), and optionally components (D) and/or (E).

Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device

The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

A prepreg comprising: carbon fibers; and a resin composition containing an epoxy resin having a biphenyl structure, a curing agent, and melamine cyanurate.

Prepreg, fiber-reinforced composite material, and molded article

A prepregcomprises: a reinforcing fiber layerincluding reinforcing fibersand a resin compositionwith which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and surface layersandprovided on the surfaces of the reinforcing fiber layerand containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particleshaving an average particle size of 5 to 50 &#x3bc;m, wherein the polyamide resin particlesinclude the polyamide 1010 resin particle.

Prepreg, fiber-reinforced composite material, and resin composition containing particles

A production method for a fiber-reinforced composite material comprises: a step of stacking a prepreg plurally to obtain a prepreg-stacked body; and a step of heating the prepreg-stacked body to cure a resin, wherein the prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 &#x3bc;m.

Production method for fibre-reinforced composite material, prepreg, particle-containing resin composition, and fibre-reinforced composite material

A fiber-reinforced composite material is provided which is capable of achieving CAI, ILSS, and interlaminar fracture toughness concurrently at high levels, in particular, capable of achieving high CAI. The composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein a cured product of a compound having in its molecule a benzoxazine ring of formula (1) and epoxy resin is impregnated with at least polyamide 12 powder: (R: C1-C12 chain alkyl group or the like; H is bonded to at least one of the carbon atoms of the aromatic ring at ortho- or para-position with respect to C to which the oxygen atom is bonded).

Fiber-reinforced composite material

A prepregcomprises: a reinforcing fiber layerincluding reinforcing fibersand a resin compositionwith which the space between fibers of the reinforcing fibersis impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layerorprovided on at least one surface of the reinforcing fiber layerand containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particleshaving an average particle size of 5 to 50 &#x3bc;m, wherein the polyamide resin particlesinclude a particle made of a polyamide

Disclosed is a novel photosensitizer that can absorb light in a wide visible light region and in the case of a very thin film form, can enhance a light absorption efficiency by virtue of a large light absorption coefficient. The photosensitizer is used for metal oxide semiconductor electrodes and comprises a metal complex represented by a general formula MLLX, wherein M is a group 8 transition metal of the periodic table, Xs are each independently a halogen atom, a cyano group, a thiocyanate group, an isothiocyanate group, an isocyanate group, an isocyanide group or a hydroxyl group, or a bidentate ligand in the case where Xs are bonded to one another, Land Lare each a ligand having an aromatic ring, and either Lor Lhas a functional group having a COOH group or PO(OH), and when the photosensitizer is adsorbed on a metal oxide semiconductor electrode via ligands Land L, the difference &#x394;L between the energy levels of ligands Land Lin their excited states, calculated in accordance with a GAUSSIAN03 quantum chemistry calculation program is 0.25 eV or more.

Photosensitizer and photovoltaic device

An information delivery system having a service section; a plurality of nodes connected to the service section through a network and allocated with specific addresses that are unique within the network; and terminal devices for system users connected to the service section and the plurality of nodes through the network; wherein the service section acquires profile data of each node user through each node and analyzes the person profile data in order to mediate between each node user and each system user according to the profile data to help exchange information.

System for acquiring and analyzing personal profile data and providing the service of delivering various information

An electrochromic element comprises an ion conduction layer between two conducting substrates, at least one of which is transparent. The ion conduction layer contains an organic compounds, which has both a structure exhibiting a cathodic electrochromic characteristic and a structure exhibiting an anodic electrochromic characteristic.

Growing community of inventors

Tokyo, Japan

Masaki Minami