Sumitomo Electric Industries, Limited

Masaki Migita

Hiroshi Inada

Yasuhiro Iguchi

Youichi Nagai

Hiroki Mori

Hirotaka Oomori

A light emitting apparatus includes: a module including a Peltier device with a first face opposite a second face, a supporting member with a principal surface, and a light emitting semiconductor device, and a package housing the module. The supporting member principal surface has a first area that supports the first face of the Peliter device, and a second area adjacent to the first area that supports the light emitting semiconductor device. The supporting member has a circuit board with different levels to which the Peliter device and the light emitting semiconductor device are connected.

Light emitting apparatus

A light-receiving apparatus includes: a light-receiving device array including a semiconductor structure including a plurality of semiconductor mesas, a plurality of grooves each of which defines one of the semiconductor mesas, a plurality of first electrodes disposed on upper surfaces of the semiconductor mesas, a plurality of first bump electrodes disposed on the first electrodes, and a metal body disposed on a bottom surface of at least one of the grooves, the metal body being spaced apart from the first electrodes and the first bump electrodes; a semiconductor device processing an electric signal from the light-receiving device array; and an underfill disposed between the light-receiving device array and the semiconductor device. The metal body is spaced apart from a surface of the semiconductor device. The semiconductor device is joined to the light-receiving device array through the first bump electrodes.

Light-receiving device array and light-receiving apparatus

An optical sensor apparatus includes a package having a window; a sensor chip having an array of light receiving devices and a pixel electrode connected to each light receiving device, the sensor chip having an incidence surface that faces the window of the package; and a read-out circuit disposed under the sensor chip, the read-out circuit having a read-out electrode electrically connected to each pixel electrode of the sensor chip. The sensor chip and the read-out circuit are housed in the package. In plan view from the sensor chip, the read-out circuit is overlapped by the sensor chip, and the read-out circuit has no portion extending off the sensor chip.

Optical sensor apparatus

An image pickup device includes a light-receiving device unit, a processing portion, a first connection body, and a second connection body. The first connection body electrically connects a first electrode of the light-receiving device unit to a corresponding second electrode of the processing portion. The first connection body includes an indium-containing solder portion disposed between the first electrode and the second electrode, and a barrier layer for suppressing alloying of the solder portion with the first electrode and the second electrode. The second connection body includes an alloy portion formed by alloying with a solder containing a material having a melting point equal to or higher than a melting point of the first connection body and a hardness higher than that of the first connection body.

Image pickup device and method for producing the same

An image sensor includes a package having a window; a sensor chip facing the window, the sensor chip having a pixel region, the sensor chip having an electrode; a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit having a read-out electrode connected to the electrode of the sensor chip; and a shielding plate disposed outside the pixel region of the sensor chip. The shielding plate is configured to block transmission of light.

Image sensor

The present invention is to provide an optical module that installs a laser diode and a Peltier device, and to provide a method for manufacturing the optical module. The invention may relax the restriction of the solder used in the assembly thereof and may prevent the thermoelectric device from degrading the performance and the reliability thereof. The laser module includes a base, the thermoelectric device, and the carrier. The thermoelectric device is fixed to the base with a first solder, while the carrier is fixed to the thermoelectric device with a second solder whose melting point is smaller than the melting point of the first solder. When the first solder is melted to fix the thermoelectric device, the second solder is also melted to fix the carrier on the thermoelectric device.

Growing community of inventors

Fujisawa, Japan

Masaki Migita