Hitachi-High-Technologies Corporation

Mitutoyo Corporation

Tokyo Ohka Kogyo Co., Ltd.

Hitachi, Ltd.

Amada Holdings Company Ltd.

Masaki Kurihara

Toshifumi Honda

Ryo Nakagaki

Kousuke Doi

Satoshi Niikura

Toshimasa Nakayama

Hidekatsu Kohara

Toshihiko Horiuchi

Miki Kobayashi

Kenji Maruyama

Takao Konno

Ken Miyagi

Tomoyuki Hamada

Masaki Mizuochi

Kazuyuki Nitta

Eiichi Hazaki

Tomoyuki Miyazaki

Masanori Arai

Kozo Ariga

Satoshi Shimatani

Yoshimasa Fukushima

Hiroaki Kasai

Takako Suzuki

Yasuhiro Takahama

Kaname Takahashi

Masahiro Masujima

Naoki Mitsutani

Toshihiro Yamaguchi

Masahiro Nishiyama

Jota Miyakura

A press brake has a lower table arranged at lower part of left and right side frames, an upper table arranged at upper part of the side frames and facing the lower table, one of the upper and lower tables serving as a ram to be moved vertically, and left and right vertical driving units arranged on the side frames, respectively, to move the ram vertically. Strain detecting sensors are arranged on inner and outer side faces, respectively, of each of the left and right side frames, to detect strain of the side frames in such a way as to cancel horizontal deflection of the side frames and detect vertical deflection thereof.

Press brake

An image measuring apparatus according to an embodiment of the present invention comprises: an imaging device that images a workpiece to acquire an image of this workpiece; and a processing device that performs measurement of the workpiece based on this image and outputs a measurement result. Moreover, the processing device sets a region in the image, sets a plurality of first points along a contour line of this region, sequentially moves these plurality of first points so that the plurality of first points approximate to the contour line included in the image, acquires the moved plurality of first points as a plurality of second points, and calculates the measurement result based on these plurality of second points.

Image measuring apparatus and non-temporary recording medium on which control program of same apparatus is recorded

An image measuring apparatus according to an embodiment of the present invention comprises: an imaging device that images a workpiece to acquire an image of this workpiece; and a processing device that performs measurement of the workpiece based on this image and outputs a measurement result. Moreover, the processing device, based on the above-described image, generates another image whose number-of-pixels is smaller than that of the image, sets a plurality of regions based on this another image, and calculates the above-described measurement result based on these plurality of regions.

A double cone stylus includes a shank and a double cone-shaped tip attached to the tip end of the shank, the double cone-shaped tip being a rotationally symmetric body obtained by rotating a triangle having a base extending along the shank around the shank as the symmetric rotation axis. The double cone stylus allows the shape of an inner wall surface of a measurement object with the inner wall surface retracted from an upper reference plane to be measured from above.

Double cone stylus, touch probe, and method of calibrating double cone stylus

Disclosed is an image measuring apparatus including an image capture unit which captures an image of a measurement subject, an import unit which imports the image of the measurement subject which is captured by the image capture unit, a binarization unit which binarizes the image which is imported by the import unit, a contour detection unit which recognizes graphic information in the image which is binarized by the binarization unit and detects a contour of the graphic information, a corner detection unit which detects corners of the graphic information based on the contour which is detected by the contour detection unit, a setting unit which respectively sets edge detection tools on lines of the contour including the corners detected by the corner detection unit and a measurement unit which measures the graphic information by the edge detection tools which are set by the setting unit.

Image measuring apparatus and image measuring method

An image measurement apparatus includes: an imager section, an obtainment section, an outline detection section, a setting section, and a measurement section. The imager section takes an image of a subject to be measured. The obtainment section obtains a taken image of the subject taken by the imager section. The outline detection section detects, by a Hough transformation, outline of a graphic included in the image obtained by the obtainment section. The setting section sets an edge detection tool on the outline detected by the outline detection section. The measurement section measures, by the edge detection tool set by the setting section, graphic information concerning the graphic.

Image measurement apparatus and method of measuring works using edge detection tools

A method and apparatus for reviewing defects of a semiconductor device is provided which involves detecting a defect on a SEM image taken at low magnification, and reviewing the defect on a SEM image taken at high magnification, and which can review a lot of defects in a short period of time thereby to improve the efficiency of defect review. In the present invention, the method for reviewing defects of a semiconductor device includes the steps of obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.

Method and apparatus for reviewing defects of semiconductor device

In apparatuses for automatically acquiring and also for automatically classifying images of defects present on a sample such as a semiconductor wafer, a classifying system is provided which are capable of readily accepting even such a case that a large number of classification classes are produced based upon a request issued by a user, and also even such a case that a basis of the classification class is changed in a high frequency. When the user defines the classification classes, a device for designating attributes owned by the respective classification classes is provided. The classifying system automatically changes a connecting mode between an internally-provided rule-based classifier and an example-based classifier, so that such a classifying system which is fitted to the classification basis of the user is automatically constructed.

Defect classifier using classification recipe based on connection between rule-based and example-based classifiers

An apparatus for reviewing defects of a semiconductor device is provided to review a lot of defects in a short period of time thereby to improve the efficiency of defect review. A method for reviewing defects of a semiconductor device includes obtaining an image including a defect on the semiconductor device detected by a detection device by use of a scanning electron microscope at a first magnification, making a reference image from the image including the defect obtained at the first magnification, detecting the defect by comparing the image including the defect obtained at the first magnification to the reference image made from the image including the defect at the first magnification, and taking an image of the detected defect at a second magnification that is larger than the first magnification.

In order to achieve high throughput in a SEM-type defect-reviewing apparatus and method for automatically acquiring images of review defects present on samples, including: a cell comparison step subdivided into the steps of (a) providing a defect detection success ratio or defect detection success map due to at least a cell comparison scheme for each wafer or each chip, (b) selecting a review sequence of either the cell comparison scheme or a die comparison scheme on the basis of the provided defect detection success ratio or defect detection success map, (c) if the cell comparison scheme is selected, judging whether detection of the review defect is possible by executing the cell comparison scheme; and a die comparison step in which die comparison is performed if the judgment result indicates that the detection of the review defect is impossible, or if the die comparison scheme is selected in the selection step.

SEM-type reviewing apparatus and a method for reviewing defects using the same

An image processing apparatus which uses morphology is provided. A masked image is provided to a morphological processing section of the image processing apparatus. The morphological processing section calculates the opening gap of the masked image, calculates the minimum number N of iterations of dilations required for filling the opening gap and, after performing N dilations, executes N erosions to remove a mesh pattern. Then, an edge detecting section detects the edges of a wiring pattern in the image and a measuring section calculates the distance between the edges, which is the width of the wiring.

Image processing apparatus using morphology

The present invention provides a chemical amplification type positive photoresist composition which is excellent in storage stability as a resist solution in a bottle. A novolak resin or a hydroxystyrenic resin is reacted with a crosslinking agent to give a slightly alkali-soluble or alkali-insoluble resin having such a property that solubility in an aqueous alkali solution is enhanced in the presence of an acid, which is then dissolved in an organic solvent, together with (B) a compound generating an acid under irradiation with radiation to obtain a chemical amplification type positive photoresist composition wherein the content of an acid component is 10 ppm or less.

Chemically amplified positive photo resist composition and method for forming resist pattern

A composition includes (A) an alkali-soluble resin, (B) a quinonediazide ester of a compound represented by the following formula:and (C) a compound represented by the following formula:This composition is a positive photoresist composition that is excellent in sensitivity and definition and causes less shrink.

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Kawasaki, Japan

Masaki Kurihara