Dmg Mori Company Limited

Masaki Kondo

Edvard Govekar

Gideon N Levy

Matjaz Kotar

A processing machine includes a laser irradiation device that emits an annular laser beam, and a wire feeding device that feeds a wire from an inside of the annular laser beam. When a workpiece irradiation proportion parameter (WIP) represented by an equation WIP=P/P (P: laser beam power introduced onto a workpiece surface when the wire exists in an irradiation region of the laser beam, P: the laser beam power introduced onto the workpiece surface when the wire does not exist in the irradiation region) is defined, a control device controls the wire feeding device so that a wire end abuts on the workpiece surface at a beginning of additive manufacturing. The control device determines initial power Pbased on the WIP at the beginning of the additive manufacturing, and controls the laser irradiation device so that the workpiece is irradiated with the laser beam at the initial power P.

Processing machine

A laser additive manufacturing apparatus and a method thereof are provided. The apparatus includes an irradiation unit that irradiates an irradiation region with a laser beam having a light intensity distribution converted by a diffractive optical element, a head having a material supplying unit for supplying powder material to the irradiation region, and a movement mechanism which relatively moves the head and a workpiece. In the irradiation region, irradiation light forms a substantially circular spot having a light intensity distribution in which light intensity in an outer peripheral portion is higher than light intensity in a central portion, and the central portion has predetermined light intensity, and the material supplying unit supplies the powder material to the substantially circular spot.

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Yamatokoriyama, Japan

Masaki Kondo