Murata Manufacturing Co., Ltd.

Masaki Kawata

Shigeru Tago

Yuki Ito

Hirofumi Shinagawa

Kuniaki Yosui

Yuki Wakabayashi

Tsuyoshi Suesada

Makoto Takeoka

Kazuaki Higashibata

Toshiro Adachi

Wataru Yanase

Daisuke Tsuruga

Tomohiko Naruoka

Hayato Noma

Toshihiro Hosokawa

A resin circuit board includes a multilayer body, mounting land conductors, and second components. The multilayer body includes thermoplastic resin layers laminated together. The mounting land conductors are provided on a front surface of the multilayer body, and terminal conductors of a first component are bonded to the mounting land conductors by a thermal bonding method. The second components are disposed in the multilayer body and each has a modulus of elasticity greater than that of the multilayer body. When the multilayer body is seen in plan view, the second components are arranged such that a straight line connecting the second components passes through the center of gravity of the first component and such that the second components are superposed with the mounting land conductors.

Resin circuit board and resin circuit board having component mounted thereon

A component mount board includes a resin board, an electronic component, and a molding resin. A land conductor is provided in the resin board. The electronic component is mounted on a surface of the resin board, and includes a mounting terminal that is bonded to the land conductor. The resin board includes a body resin portion including the land conductor provided on a surface thereof, and a surface resin layer disposed on a surface of the body resin portion and made of a material of the same type as that of the body resin portion. A conductor is not provided on a surface of the surface resin layer. The surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board. The mounting terminal is bonded to the land conductor via a bonding material filled in the through hole.

Component mount board

A method of manufacturing a resin multilayer substrate is provided in which a component () is incorporated in a stacked body obtained by stacking a plurality of thermoplastic resin sheets (). The method includes the steps of: softening a first resin sheet () by heating, and pressing the component () against the first resin sheet (), thereby fixing the component () to the first resin sheet (); stacking the first resin sheet () on a second resin sheet () having a through hole () receiving the component () and a third resin sheet () located adjacent to a lower side of the component () such that the component () is inserted into the through hole () and the lower surface of the component () faces the third resin sheet (); and performing compression bonding by heating and pressurizing the stacked body including these resin sheets ().

Method of manufacturing resin multilayer substrate

A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.

Component-embedded substrate

A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred.

Method for manufacturing resin multilayer board

A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.

Module component

A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions.

Production method of component-embedded substrate, and component-embedded substrate

An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular. The plurality of bonding material applying lands are arranged on the rear surface. The plurality of bonding material applying lands includes outer peripheral land rows, each of which is arranged in a line along each side of the rear surface with the exception of corner portions of the rear surface. The plurality of bonding material applying lands includes corner portion inner lands, each of which is arranged on the rear surface at a location that is shifted inwardly in a substantially diagonal direction from the corner portion and is adjacent to the bonding material applying lands closest to the corner portion at ends of the outer peripheral land rows that are arranged in lines along two sides that are connected by the corner portion.

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Nagaokakyo, Japan

Masaki Kawata