Dainippon Screen Mfg. Co., Ltd.

Screen Holdings Co., Ltd.

Dainippon Screen Mgf. Co., Ltd.

Masaki Iwami

Masami Ohtani

Joichi Nishimura

Akihiko Morita

Hiroaki Ishii

Kazuki Inoue

Masao Tsuji

Yasuo Imanishi

Daichi Yoshitomi

Takanori Kawamoto

Soichi Nadahara

Tetsuya Hamada

Kenya Morinishi

Toyohide Hayashi

Kenji Kamei

Satoshi Yamamoto

Kazuhiro Nishimura

Kentaro Tokuri

A substrate processing device includes a holding member for holding a substrate, and an opposed member having a body portion and an extended portion extending from at least a part of a peripheral edge part of the body portion. A protrusion is provided on one part of a tip side part of the extended portion and a side surface part of the holding member, and the other part is provided with a restricting structure disposed opposite to the protrusion and restricting relative motion of the protrusion. The relative motion between the holding member and the opposed member is restricted, and the substrate processing device further includes a rotating mechanism, and a nozzle for discharging a processing solution and the protrusion and the restricting structure are disposed below an upper surface of the holding member.

Substrate processing device and substrate processing method

A substrate treatment apparatus includes a substrate holding mechanism which holds a substrate, a scrub brush for scrubbing a surface of the substrate held by the substrate holding mechanism to remove foreign matter from the substrate surface, a treatment liquid supplying mechanism which supplies an alkaline treatment liquid to the substrate surface when the substrate is scrubbed with the scrub brush, and an alkaline fluid supplying mechanism which supplies an alkaline fluid to a surface of the scrub brush in a standby period during which no substrate is scrubbed with the scrub brush.

Substrate treatment apparatus and substrate treatment method

An apparatus causes a substrate to rotate and supplies a treatment liquid to a substrate surface to make a treatment, without concern that a mixed substance is eluted from a cup in the use for a long time, or a thin film comes off from an inside wall surface to be contamination-causing substances even if the cup made of a water-repellent material for collecting a treatment liquid becomes hydrophilic. A cupdisposed to surround the sides and underside of a substrate W rotating while being held by a spin chuck, and serving to collect a treatment liquid diffused from the substrate to the surroundings, is made of a plastic material. Further, an inside wall surface of an upper-side cup partof the cup, being a portion on which the treatment liquid having been diffused from the substrate impinges, is roughened to be a hydrophilic surface.

Substrate rotation type treatment apparatus

A substrate heat-treating apparatus includes a heat-treating plate, and support pins extending through the heat-treating plate to be vertically movable relative thereto. The support pins support each substrate at a lower surface thereof such that edges of the substrate are at a higher level than a central region of the substrate. This construction facilitates air flows into and out of a space between the lower surface of the substrate and the upper surface of the heat-treating plate when the substrate is vertically moved.

Substrate heat-treating apparatus

A substrate processing apparatus reduces an instantaneous maximum power consumption at turn-on. Power receiving parts of a plurality of processing units are connected to one end of a turn-on switch respectively through switches. The other end of the turn-on switch is connected to an external power source through a breaker. Timer values are set in advance in the timers, respectively. When the turn-on switch is turned on, the timers turn on the associated switches respectively after times which are defined by the timer values, whereby the processing units are provided with electric power, each with a delay of a constant time.

Substrate processing apparatus having regulated power consumption and

A unit arrangement part comprises a chemical cabinet on its lowermost part, while coating units for forming a resist film on a substrate and developing units for developing the substrate after exposure are arranged on four corners of an apparatus above the chemical cabinet. Further, multistage thermal processing units for thermal-processing the substrate are arranged on front and rear portions of the apparatus above these wet processing units. A cleaning unit for supplying a cleaning liquid such as pure water and cleaning the substrate is arranged on a front side of the apparatus between the coating units as a substrate processing unit. Thus provided is a substrate processing apparatus having excellent workability in maintenance with a high degree of freedom in arrangement of processing units.

Substrate processing apparatus, substrate transport apparatus and

A degassing module mounted in an intermediate position of a delivery pipe includes a fluid passage formed of a gas-permeable film material. The fluid passage is enclosed in a gas-tight vacuum chamber. A degassing pipe is connected to the vacuum chamber. The degassing pipe has a switch valve for breaking a communication between a sealed space in the vacuum chamber and a vacuum source, thereby forming a closed section including part of the degassing pipe and the sealed space in the vacuum chamber. A reduced quantity of solvent evaporates from a treating solution flowing through the fluid passage of the degassing module, and passes in the form of solvent vapor through the gas-permeable film material into the sealed space of the vacuum chamber. This minimizes change in the concentration and temperature of the treating solution flowing through the degassing module. The degassing pipe has a trap formed in an intermediate position thereof. A liquid level sensor detects the treating solution collected in a predetermined quantity in the trap. An alarm is given in response to a detection signal from the sensor. When the fluid passage of the degassing module is broken, the abnormality is detected reliably to avoid inconveniences due to a decrease in the degassing capability of the degassing module.

Treating liquid supplying method and apparatus

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Kyoto, Japan

Masaki Iwami