Japan Aviation Electronics Industry, Limited

Hitachi High-tech Corporation

Hitachi-high-technologies Corporation

Mitsubishi Heavy Industries Engineering, Ltd.

Masaki Ishiguro

Hideto Shimazu

Yuichi Koreeda

Masahiro Sumiya

Kazuyuki Ikenaga

Shigeru Shirayone

Tomoyuki Tamura

Osamu Takagi

Takuya Shiraishi

Takashi Tokunaga

Junichi Miyamoto

Yuichi Uchiyama

Minoru Shinmyo

Tomoyuki Uchida

Naoki Katagiyama

Takayuki Tanaka

Hideo Sugimoto

Osamu Imaki

Yasutaka Hiroki

Chikara Kawamura

Shingo Nakajima

Osamu Hashiguchi

Hiroyuki Kobayashi

Hideo Suzuki

Kenji Tamaki

Shigeru Yoshioka

Seiji Furukawa

Katsunori Matsui

Gaku Kondo

Shota Umeda

Masayuki Tabata

Makoto Nawata

Akihiro Tosaki

Connector

Provided is a plasma processing apparatus capable of obtaining desired etch profiles and preventing the degradation of yield rates due to the adhesion of particles, and equipped with a processing chamber in which a sample is plasma-treated; a radio-frequency power source for supplying radio-frequency power used to generate plasma; a sample stage which is provided with electrodes for electrostatically adsorbing the sample and on which the sample is mounted; and a DC power supply for applying DC voltages to the electrodes, the apparatus being further equipped with a control apparatus for controlling the DC power supply so as to apply such DC voltages as to decrease the absolute value of the potential of the sample in the absence of the plasma.

Plasma processing apparatus

The invention provides a plasma processing apparatus which includes a processing chamber, a radio frequency power source to supply a radio frequency power for plasma generation, a sample stage equipped with an electrostatic chuck electrode of a sample, a DC power source to apply a DC voltage to the electrode, and a control unit to change the DC voltage from a predetermined value to almost 0 V when a predetermined time elapses since the supplying of the radio frequency power is stopped. The predetermined value is a predetermined value indicating that a potential of the sample when the DC voltage is almost 0 V becomes almost 0 V. The predetermined time is a time defined on the basis of a time when charged particles generated by the plasma processing disappear or a time when an afterglow discharge disappears.

Plasma processing apparatus and method for releasing sample

A plasma processing apparatus includes: a plasma processing chamber; a radio frequency power source; a sample stage on which a sample is mounted; an electrode which is arranged inside the sample stage and electrostatically chucks the sample; a DC power source which applies a DC voltage to the electrode; and a control device which controls an output voltage of the DC power source so that an electric potential difference between an electric potential of the sample and an electric potential of an inner wall of the plasma processing chamber is reduced to an electric potential difference within a predetermined range during interruption of plasma discharge.

Provided is a state prediction apparatus that predicts a state of the plasma processing apparatus, a first set of features that indicates the state of the plasma processing apparatus is determined based on monitored data of the plasma processing apparatus in a normal state, a second set of features that indicates the state of the plasma processing apparatus is determined based on monitored data of the plasma processing apparatus, the features in the second set are calculated by using the features in the first set, a model that predicts the state of the plasma processing apparatus is generated by using a subset of the first set of features, which is composed of the same kind of features selected in descending order of the calculated features in the second set, and the state of the plasma processing apparatus is predicted by using the generated model.

State prediction apparatus and semiconductor manufacturing apparatus

In a diagnosis apparatus for diagnosing a state of a plasma processing apparatus, prior distribution information including a probability distribution function is previously obtained for each of first sensors by using first sensor values obtained by the first sensors in a first plasma processing apparatus, a probability distribution in each of second sensors corresponding to each of the first sensors is estimated based on the previously obtained prior distribution information and second sensor values obtained by the second sensors in a second plasma processing apparatus different from the first plasma processing apparatus, and a state of the second plasma processing apparatus is diagnosed by using the estimated probability distribution.

Diagnosis apparatus, plasma processing apparatus and diagnosis method

This connector () is provided with a locking member (), a receiving part (), an additional elastic part () and a pressing member (). The locking member () comprises a supporting part () and a locking part (). A mating-side connector () is provided with a mating-side locking part () and an abutting part (). In the fitted state, the locking part () applies backwards force on the mating-side locking part () with the elasticity of the supporting part (). The abutting part () is positioned in front of the receiving part (), is pressed against the receiving part (), and is restricted from moving backwards by the receiving part (). When the pressing member () is in a first position, the additional elastic part () is interposed between the supporting part () and the pressing member (), presses down the supporting part (), and maintains pressing of the locking part () against the mating-side locking part (). In this way, in the fitted state, even when an outside force in the fitting direction is applied to the connector () or the mating-side connector (), the connector () does not move in the fitting direction relative to the mating-side connector ().

Connector device

A plug connector is attachable with an optical fiber cable and is connectable with a receptacle connector. The receptacle connector comprises a receptacle shell. The plug connector comprises a front holder, a cable holding portion, a rear holder and a coupling member. The front holder is made of metal. The front holder is mated with the receptacle shell when the plug connector is connected with the receptacle connector. The cable holding portion is made of metal. The cable holding portion is configured to hold the optical fiber cable. The rear holder guards the cable holding portion. The rear holder comprises, at least in part, a thermal insulating portion made of non-metal material. The coupling member couples the front holder and the rear holder with each other. Each of the coupling member and the front holder is in contact with the rear holder only on the thermal insulating portion.

Plug connector

A sample releasing method for releasing a sample subjected to plasma processing from a sample stage on which the sample is electrostatically attracted by applying DC voltage to an electrostatic chuck electrode, and the method includes: moving the sample subjected to the plasma processing upward above the sample stage; and after moving the sample, controlling the DC voltage such that an electric potential of the sample is to be smaller.

Method for releasing sample and plasma processing apparatus using same

A data processing apparatus in which a trade-off between over-learning prevention and calculation load prevention is eliminated when creating a model formula is provided. The data processing apparatus includes: a recording unit that records electronic data; and a computing unit that performs computing using the electronic data, in which the computing unit includes a feature amount selection unit used for computing, and the feature amount selection unit performs feature amount selection including: a first step (S) of ranking feature amounts and rearranging the feature amounts from top; a second step (S) of creating a plurality of data groups using only a part of the feature amounts according to the order; a third step (S) of calculating a value that is an index for evaluating prediction performance of a regression or classification problem using each of the data groups using only a part of the feature amounts; a fourth step (S) of deleting feature amounts based on the calculated prediction performance index; and a fifth step (S) of updating the order of the feature amounts, which are feature amounts other than the deleted feature amount, using the prediction performance index, in which the second step to the fifth steps are iterated (S) until an optimal value of the prediction performance index calculated in the third step is no longer updated.

Data processing apparatus, data processing method and semiconductor manufacturing apparatus

Growing community of inventors

Tokyo, Japan

Masaki Ishiguro