Hamamatsu-photonics K.k.

Sony Corporation

Matsushita Electric Industrial Co., Ltd.

Nippon Telegraph and Telephone Corporation

Ntt Electronics Corporation

Sony Group Corporation

Nihon Dempa Kogyo Co., Ltd.

Canon Kabushiki Kaisha

Mitsubishi Heavy Industries Limited

Mitsubishi Heavy Industries Thermal Systems, Ltd.

Masaki Hirose

Katsumi Shibayama

Takashi Kasahara

Toshimitsu Kawai

Hiroki Oyama

Takafumi Yokino

Yumi Kuramoto

Yumi Teramachi

Katsuhiko Kato

Satoshi Katsuo

Jun Yoshikawa

Norikazu Ito

Masashi Ito

Hisao Tanaka

Tomohisa Shiga

Satoshi Yoneya

Masakazu Yoshimoto

Yoshihiro Maruyama

Takashi Furukawa

Hiroyuki Fujita

Motohiro Terao

Takayoshi Kawamura

Koichi Sato

Kazuto Ofuji

Hideki Ando

Hiroaki Kikuchi

Tatsushi Bannai

Koji Kamiya

Yoshiho Gotoh

Tomofumi Suzuki

Toru Hirohata

Yoshihisa Warashina

Yoshiaki Shibata

Akira Yamaguchi

Mitsutoshi Shinkai

Mahito Yoshioka

Keita Nakajima

Kazushi Nishikata

Takeshi Inagaki

Satoru Taniguchi

Fumiki Inui

Takaaki Fuchie

Taisuke Minagawa

Hirohiko Aiba

Hideaki Mita

Takashi Honke

Satoshi Yutani

Anna Yoshida

Jun Onuki

Mitsushi Mineno

Shouji Nakamura

Tomoyuki Endo

Takaya Ono

Hiroshi Saitou

Mikio Kyomasu

Shigeru Suzuki

Kei Tabata

Hiroki Kamei

Atsuo Yada

Haruhiko Ichino

Yukio Akazawa

Minoru Takase

Takehiko Yashiro

Shiro Hagihara

Ichiro Kubota

Hirofumi Murakami

Ichiro Fujisawa

Kazuo Kamiyama

Masatoshi Tobayashi

Yoshizo Mihara

Takeshi Yoshida

Kenji Hyodo

Takehito Ishii

Shoji Nakamura

Noritoshi Kimura

Keiichi Teranishi

Gentaro Okayasu

Hiroki Hamaguchi

Syuichi Takazawa

Katsuhito Toyoda

Kazutaka Iinuma

Yasuhiko Takeo

Yuki Kuga

Atsuyuki Sumiya

Kenzo Ono

Kenzo Oono

A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.

Production method for Fabry-Perot interference filter

An optical filter device includes: a Fabry-Perot interference filter that includes: a first structural body having first and second surfaces; a second structural body having a third surface; a first mirror portion provided to the first structural body; a second mirror portion provided to the second structural body so as to face the first mirror portion via an air gap; a first driving electrode provided to the first structural body; a second driving electrode provided to the second structural body; first and third terminals electrically connected to the first driving electrode; and a second terminal electrically connected to the second driving electrode. A distance between the first driving electrode and the air gap is shorter than a distance between the second surface and the air gap. A resistance measurement unit is electrically connected to the first and third terminals and measures a resistance value of the first driving electrode.

Optical filter device and method for controlling optical filter device

A spectroscopic sensor includes a wiring substrate having a main surface, a light detector disposed on the main surface of the wiring substrate, a Fabry-Perot interference filter, a spacer which is provided on the main surface of the wiring substrate and supports the Fabry-Perot interference filter so that the Fabry-Perot interference filter and the light detector are separated from each other, and a stem connected to a ground potential. A second current path which has a smaller electric resistance than that of an arbitrary first current path which extends from the Fabry-Perot interference filter to the light detector via the spacer and the wiring substrate is formed between the Fabry-Perot interference filter and the stem.

Light detection device

A transportation method for transporting an object including a plurality of Fabry-Perot interference filters, the transportation method including a first step of accommodating the object in an accommodating container, wherein the Fabry-Perot interference filter includes a substrate, a first mirror portion and a second mirror portion provided on the substrate to face each other via a gap and in which a distance from each other is variable, and in the first step, the object is accommodated and supported in the accommodating container in a state where the plurality of Fabry-Perot interference filters is two-dimensionally arranged.

Transportation method

A light detection device of the present invention includes: a wiring board; a first support part disposed on a mounting surface of the wiring board; a Fabry-Perot interference filter having a first mirror part and a second mirror part between which a distance is variable and having an outer edge portion disposed in a first support region of the first support part; a light detector disposed on the mounting surface to face the first mirror part and the second mirror part on one side of the first support part; and a temperature detector disposed on the mounting surface, wherein the temperature detector is disposed on the mounting surface such that at least a part of the temperature detector overlaps a part of the Fabry-Perot interference filter when seen in a first direction perpendicular to the mounting surface and such that at least a part of the temperature detector overlaps a part of the first support part when seen in a second direction in which the first support part and the light detector are aligned with each other, and wherein a first distance between the temperature detector and the first support part in the second direction is smaller than a first width of the first support region in the second direction.

An electrical inspection method includes: a step of preparing a wafer in which a plurality of Fabry-Perot interference filter portions is formed, each of the plurality of Fabry-Perot interference filter portions in which a distance between a first mirror portion and a second mirror portion facing each other varies by an electrostatic force; and a step of inspecting electrical characteristics of each of the plurality of Fabry-Perot interference filter portions.

Electrical inspection method

To enable HDR video signals of a plurality of signal interfaces to be satisfactorily handled. [Solution] A processing unit processes a linear high dynamic range video signal and obtains a high dynamic range video signal that has undergone a grayscale compression process. The processing unit is able to perform grayscale compression processes of a plurality of signal interfaces. For example, when a grayscale compression process of another signal interface other than a reference signal interface is performed, the processing unit further performs a process of adding characteristics of system gamma of the reference signal interface and a process of cancelling out characteristics of system gamma of the other signal interface.

Signal processing device, signal processing method, camera system, video system, and server

A suction method is provided as a method of performing, by using a suction collet, suction of a Fabry-Perot interference filter including a substrate and a laminated structure that is provided on the substrate and that includes a main surface facing the side opposite to the substrate, the method including a first step of arranging the suction collet so as to face the main surface, a second step of bringing the suction collet into contact with the Fabry-Perot interference filter after the first step, and a third step of suctioning the Fabry-Perot interference filter by using the suction collet after the second step.

Suctioning method

A suction method is provided as a method of performing, by using a suction collet, suction of a Fabry-Perot interference filter including: a substrate; a laminated structure that is provided on the substrate and that includes a main surface facing a side opposite to the substrate; and a thinned portion that is located outside the laminated structure when viewed in a direction intersecting the main surface and that is recessed to a side of the substrate with respect to the main surface, the method including: a first step of arranging the suction collet so as to face the main surface; a second step of bringing the suction collet into contact with the Fabry-Perot interference filter after the first step; and a third step of suctioning the Fabry-Perot interference filter by using the suction collet after the second step.

Suction method

A light detection device includes: a Fabry-Perot interference filter provided with a light transmission region; a light detector configured to detect light transmitted through the light transmission region; a package having an opening and accommodating the Fabry-Perot interference filter and the light detector; and a light transmitting unit arranged on an inner surface of the package so as to close an opening, the light transmitting unit including a band pass filter configured to transmit light incident on the light transmission region. When viewed from a direction parallel to the line, an outer edge of the Fabry-Pert interference filter is positioned outside an outer edge of the opening, and an outer edge of the light transmitting unit is positioned outside the outer edge of the Fabry-Perot interference filter.

A light detection device includes: a first support part disposed on a mounting surface of the wiring board; a Fabry-Perot interference filter disposed in a first support region of the first support part; and a temperature detector, wherein the temperature detector is disposed on the mounting surface such that at least a part of the temperature detector overlaps a part of the Fabry-Perot interference filter when seen in a first direction perpendicular to the mounting surface and such that at least a part of the temperature detector overlaps a part of the first support part when seen in a second direction in which the first support part and the light detector are aligned with each other, and wherein a first distance between the temperature detector and the first support part in the second direction is smaller than a first width of the first support region in the second direction.

A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. In the wafer, a gap is formed between the first mirror portion and the second mirror portion so as to form a plurality of Fabry-Perot interference filter portions. A wafer inspection method according to an embodiment includes a step of performing faulty/non-faulty determination of each of the plurality of Fabry-Perot interference filter portions, and a step of applying ink to at least part of a portion overlapping the gap when viewed in a facing direction on the second mirror layer of the Fabry-Perot interference filter portion determined as faulty.

Wafer inspection method and wafer

A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. A plurality of Fabry-Perot interference filter portions are formed in an effective area, in each of the plurality of Fabry-Perot interference filter portions a gap is formed between the first mirror portion and the second mirror portion. A plurality of dummy filter portions are formed in a dummy area disposed along an outer edge of the substrate layer and surrounding the effective area, in each of the plurality of dummy filter portions an intermediate layer is provided between the first mirror portion and the second mirror portion. At least the second mirror portion is surrounded by the first groove in each of the plurality of Fabry-Perot interference filter portions and the plurality of dummy filter portions.

Wafer

A light detection device includes a Fabry-Perot interference filter, a light detector, a spacer that has a placement surface on which a portion outside a light transmission region in a bottom surface of the interference filter is placed, and an adhesive member that adheres the interference filter and the spacer to each other. Elastic modulus of the adhesive member is smaller than elastic modulus of the spacer. At least a part of a lateral surface of the interference filter is located on the placement surface such that a part of the placement surface of the spacer is disposed outside the lateral surface. The adhesive member is disposed in a corner portion formed by the lateral surface of the interference filter and the part of the placement surface of the spacer and contacts each of the lateral surface and the part of the placement surface.

Optical detection device having adhesive member

Growing community of inventors

Tokyo, Japan

Masaki Hirose