Sumitomo Electric Industries, Limited

Masaki Furumai

Hiromi Nakanishi

Toru Hiyoshi

Keiji Wada

Kosuke Uchida

Mitsuhiko Sakai

Tomoyuki Funada

Manabu Yoshimura

Kazunori Yoshida

Yoshiki Kuhara

Satoshi Yoshimura

Manabu Shiozaki

Kazuhito Saito

Shuzo Suzuki

Hitoshi Terauchi

Takashi Kounosu

Shin Satoh

The semiconductor device in accordance with one mode comprises a semiconductor chip; a chip mounting substrate on which the semiconductor chip is mounted; a chip container that is provided on the chip mounting substrate and contains the semiconductor chip; and a seal part that seals the chip container containing the semiconductor chip and the chip mounting substrate. The chip container has a frame part surrounding a periphery of the semiconductor chip. The height of the frame part is greater than that of the semiconductor chip. The inside of the frame part in the chip container is provided with a chip coating material that protects the semiconductor chip.

Semiconductor device

A silicon carbide semiconductor device includes a silicon carbide layer, an element region including a semiconductor element portion formed in the silicon carbide layer, a JTE region (first electric field relaxing region), an insulating film disposed on a first main surface and covering the JTE region, and a pad electrode electrically connected to the JTE region. The pad electrode includes an extension portion extending from an end of the JTE region close to the element region in a peripheral direction from the element region toward the JTE region, the extension portion being disposed on the insulating film. The extension portion overlies at least a portion of the JTE region.

Silicon carbide semiconductor device

A method to produce an optical module, in particular, a module to transmit an analog data to enhance a yield thereof is disclosed. The method comprises (a) taking an I-L characteristic and its slope efficiency, (b) taking a gradient of a linear approximation between the slope efficiency and a current applied to an LD, and (c) taking an optimum current for the CSO characteristic as varying the current. Steps (a) to (c) give a correlation between the gradient of the linear approximation and the optimum current and are performed in advance to the practical production.

Method to produce an optical module for analog data transmission

The present invention provides a bi-direction optical assembly with two optical transmitting channels by a small-sized package and relatively low cost. In the bi-directional optical assembly, the first transmitting optical subassembly (TOSA) and the receiving optical subassembly (ROSA) are optically coupled with the optical fiber via the inner housing. While the second transmitting optical subassembly is optically coupled with the optical fiber via the outer housing slidable to the inner housing.

Bidirectional optical assembly and method for manufacturing the same

The present invention provides an optical receptacle capable of reducing the optical coupling loss with the connector plug to be mated with the receptacle, and an optical module installing the receptacle. The receptacle of the invention includes an optical waveguide, a stub, and a body. The stub includes a first bore, into which the waveguide is disposed, and a second bore. The waveguide may be made of same material as that constituting the core of the optical fiber, and may have a substantially same diameter as that of the cladding. Thus, the aperture for coupling the optical fiber may be expanded.

Optical receptacle having stub capable of enhancing optical coupling efficiency and optical module installing the same

The present invention provides a semiconductor laser module in which parasitic inductance due to the bonding wire is removed, accordingly, the high frequency performance thereof can be enhanced. The laser module of the present invention has a sub-mount, on which the semiconductor laser diode is installed and transmission lines for supplying the signal to the laser diode is formed. The transmission lines on the sub-mount are directly connected to corresponding lead pins provided in the base of the package without any bonding wires. Between the lead pins and under the sub-mount is provided a photo diode for monitoring light emitted from the laser diode.

Semiconductor laser module having a co-axial package and transmission lines for complementary driving signal

A semiconductor laser module has a stem base and a stem block provided thereon. A submount is fixed on the block, and a laser diode (LD) is mounted on the submount. Transmission lines are formed on the submount and connected to the anode and cathode of the LD. Lead pins extend through the stem base to be connected to the transmission lines. A photodetector is disposed, below the LD, on the stem base. Aperture for placement of the photodetector is formed in the submount, and the photodetector is placed at least partially in this aperture.

Semiconductor laser module and semiconductor laser apparatus

The ferrule partcomprises ferrule, first and second optical fibersand, and optical filter. Ferrulehas first and second end surfaceand, ferrule insertion hole, and groove. Ferrule insertion holeextends along a first axis, and accommodates first and second optical fibersand. Grooveextends along a second axis crossing the first axis, and extends so as to extend across ferrule. Grooveis provided along a plane defined by the second axis and a third axis perpendicular to the first and second axes. Optical filtercan reflect a part of light incident on one surfaceof the pair of surfaces of optical filter, and can transmit a part of the light incident on other surface

Ferrule part and optical communications module

An optical semiconductor module with a downsizeable structure is provided. An optical semiconductor module comprises a mounting member , first member , optical semiconductor element , second member , and optical fiber . The mounting member extends along a reference surface intersecting an axis . The first member has a tubular portion extending in a direction of the axis , a first end formed at one end of the tubular portion and fixed to the mounting member, and a second end formed at the other end of the tubular portion . The optical semiconductor element is arranged in the tubular portion of the first member such that its optical axis is directed in a direction of the predetermined axis . The second member has a tubular portion extending in a direction of the axis , and is fixed to the second end of the first member . The optical fiber extends in the tubular portion of the second member such that it is optically coupled to the optical semiconductor element

Growing community of inventors

Osaka, Japan

Masaki Furumai