Murata Manufacturing Co., Ltd.

Masaki Fukuda

Takashi Yamamoto

Jinya Furui

Takashi Inoue

Yuji Fukada

A multilayer ceramic capacitor includes a first multilayer ceramic capacitor main body including a first external electrode, a second multilayer ceramic capacitor main body including second external electrodes, a first bonding material bonding the first and second external electrodes, a first metal terminal and a second metal terminal respectively connectable to the first external electrode, and an exterior material covering the respective first and second multilayer ceramic capacitor main bodies and a portion of each of the first and second metal terminals. The first bonding material is bonded to the exterior material. A porosity of the first bonding material is higher than a porosity of the exterior material.

Multilayer ceramic electronic component

A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode, a second metal terminal connected to the second external electrode, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. Upper and lower surfaces of the exterior material are flat or substantially flat.

Surface mount electronic component

A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode by solder, a second metal terminal connected to the second external electrode by the solder, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. The solder satisfies a relational expression: element diameter D (mm)&#xd7;about 0.003 mm&#x2264;solder cross-sectional area S (mm)&#x2264;element diameter D (mm)&#xd7;about 0.02 mm.

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Nagaokakyo, Japan

Masaki Fukuda