Murata Manufacturing Co., Ltd.

Masaki Fujiyama

Yukio Sanada

Kunihiko Hamada

Shinichiro Kuroiwa

Akira Otani

Hiromasa Takahashi

Akira Ohtani

Shuji Mushimoto, Deceased

Mika Yamamoto

An electrically conductive paste which ensures formation of a dense electrode film even in a low-oxygen-concentration atmosphere without strict control of the atmosphere is described. The electrically conductive paste comprising Cu powder, glass frit and an organic binder resin, wherein the glass frit comprises Zn- and Cu-containing borosilicate glass and in the melt state has a contact angle with respect to Cu of 90&deg; or less as measured in a nitrogen atmosphere.

Electrically conductive paste and electronic element

Provided is a conductive paste, including a metal powder, glass frit and SiO,dispersed in an organic vehicle in which the compounding ratio of SiO,is in the range of 0.3 to 1.5% by weight. The conductive paste can prevent scattering of a solder plating film formed on a thick film electrode during surface mounting of a ceramic electronic part including a thick film electrode (an external electrode) which is formed by coating the ceramic electronic part with the conductive paste and baking.

Conductive paste and ceramic electronic part including the same

A conducting thick film composition, a thick film electrode made by sintering this composition, and a ceramic electronic component and a laminated ceramic capacitor in which this thick film electrode is used of which the electrical reliability are improved by the strength of the bond between the ceramic substrate and a thick film electrode being increased by the elimination of blistering and cracking of the electrode during sintering of the composition and the adherence of solder to the electrode being improved by the elimination of glass separation out onto the surface of the electrode during sintering. The conducting thick film composition comprises Cu powder, glass powder and an organic vehicle, the Cu powder comprises spherical powder and scaly powder and the glass powder comprises borosilicate zinc glass and borosilicate barium glass.

Conducting thick film composition, thick film electrode, ceramic

A base metal composition for forming an external electrode of a multilayer electronic component contains 70 to 85 percent by weight of Cu, 2 to 10 percent by weight of glass frit and 10 to 28 percent by weight of an organic vehicle. The glass frit contains at least one of lead zinc borosilicate and zinc borosilicate, Ba-Si based glass, and Zn which is in a range of less than 10 percent by weight in terms of ZnO.

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Moriyama, Japan

Masaki Fujiyama