Kabushiki Kaisha Toshiba

Masaki Adachi

Takao Abe

Norio Tashiro

Iwao Matsumoto

Tetsuya Muranaka

Tomoko Honda

Isao Ogawa

Hisao Saito

Megumi Yamamura

Fumihide Nagashima

Masataka Komine

Toshiaki Hosoya

Toshio Ikeda

Masaharu Yamanaka

Saburo Matsushita

Tatsuhiko Nagafuchi

Masayoshi Harada

Hirofumi Hansei

Kenji Naito

Hironari Kotsubo

A light emitting device includes: a light emitting element;

Light emitting device with a recess lead portion

A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.

Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig

A composition for sealing a semiconductor device contains polyphenylene sulfide wherein a line expansion coefficient at 150&deg; C. to 200&deg; C. is 4.75&times;10,&lsqb;1/&deg;C.&rsqb; or less, a line thermal expansion coefficient at 80 to 130&deg; C. is 6.0&times;10,&lsqb;1/&deg;C.&rsqb; or less, and a line expansion coefficient ratio between the flow direction and a normal direction of the flow direction is 0.55 or more.

Semiconductor device

A reusable packaging material for semiconductor devices. The semiconductor device package is formed from a thermoplastic resin. The resin has good fluidity and good adhesion. The new package is recyclable because the thermoplastic resin hardening process is reversible. The new package has sufficient mechanical strength and adhesion to seal a semiconductor device. A thermoplastic material for sealing a semiconductor element is characterized by 4.5&times;10,&lsqb;1/.degree.C.&rsqb; or less linear thermal expansivity at about 150-200 .degree.C.

Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same

A semiconductor device comprising a package formed of a thermoplastic resin, first and second lead frames arranged parallel to each other with a predetermined space interposed therebetween, and each having a distal end portion of a predetermined length located in the package, solder films formed on the first and second lead frames from outside the package to inside the package, a semiconductor element mounted on the distal end portion of the first lead frame and having an electrode, and a bonding wire having an end connected to the electrode of the semiconductor element, and another end connected to the distal end portion of the second lead frame.

In a magnetron for microwave oven, a high-voltage input terminal structure 30 is provided on a shield box 26 mounted on a magnetron unit 22. The high-voltage input terminal structure 30 has a cylindrical earth electrode 33, a cylindrical high potential inner electrode 32 and a central conductor 31a. The cylindrical earth electrode 33 is secured to the shield box 26 and the cylindrical high potential inner electrode 32 is coaxially arranged in the cylindrical earth electrode 33. The central conductor 31a is connected through an inductor 28 to a cathode lead 27 of the magnetron unit 22. An insulating resin 34b is filled in a gap between the cylindrical earth electrode 33 and the highpotential electrode 32 to form a capacitor section C. Cylindrical insulating sheaths 37, 38 are formed by the resin on the both sides of the capacitor section C. The capacitor section C and the cylindrical insulating sheaths, 37, 38 are integrally formed and continuously extended along a straight line.

High-voltage input terminal structure of a magnetron for a microwave oven

Growing community of inventors

Fukuoka-ken, Japan

Masaki Adachi