Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Masakazu Watanabe

Hikaru Sugi

Kazushi Shikata

Norihisa Sasano

Toshiki Sugiyama

Ikuo Ozawa

Kenichi Mori

Hisashi Kayano

Eiichi Kamei

Katsuhiko Sugito

Shuhei Eguchi

Kazunori Nakamura

A method for manufacturing a semiconductor device is provided. The method includes forming an organosilicon compound layer on a surface of an oxide semiconductor substrate, heating the oxide semiconductor substrate provided with the organosilicon compound layer at a first temperature to form a silicon diffusion layer inside the oxide semiconductor substrate, and removing the organosilicon compound layer from the surface of the oxide semiconductor substrate after heating the oxide semiconductor substrate at the first temperature.

Method for manufacturing semiconductor device

A semiconductor device includes a semiconductor substrate; an insulating film arranged on the semiconductor substrate; an electrode that contacts a portion of a side surface of the insulating film; a first passivation film that is arranged extending from the electrode to the insulating film, and contacts a surface of the insulating film, and contacts a surface of the electrode; and a second passivation film that is arranged on the first passivation film. A difference between a linear expansion coefficient of the first passivation film and a linear expansion coefficient of the insulating film is smaller than a difference between the linear expansion coefficient of the first passivation film and a linear expansion coefficient of the electrode, and a position where the first passivation film contacts a boundary between the electrode and the insulating film is positioned lower than an upper surface of the insulating film.

Semiconductor device and manufacturing method of same

A front-end module, including a heat exchanger including a radiator and a condenser integrated with each other, brackets, etc. and having a dual function as a strength member for the vehicle body, is mounted on an automotive vehicle. As a result, the front end panel is eliminated, and a simple structure is provided in which the parts which can be assembled on the front end of the vehicle, including the radiator, the condenser, headlights, a hood lock, a horn and sensors, can be assembled on the vehicle.

Vehicle-mounted structure for heat exchanger

To simplify the assembling of a vehicular cockpit module assembly, an instrument panel and its peripheral devices are divided into a plurality of sub module assemblies each of which having a corresponding main device. Each of the assemblies is assembled as a unit, and then the assemblies are mutually assembled. The assembling of each sub module assembly is completed to form a unit in advance.

Vehicular cockpit module assembly and assembling method

An assembly process apparatus includes an assembly robot for assembling parts to a workpiece which is a main body, a part supply apparatus for supplying parts to the workpiece, a work pallet for supplying workpieces to an assembly station of the assembly robot, and a tool pallet for supplying assembly process modules interchangeable with respect to the assembly robot. The part supply apparatus is made up of a plurality of part supply modules interchangeable with respect to the assembly robot. With the assembly process apparatus as one unit, it is constructed to assemble parts one unit only or with a plurality of units combined. Accordingly, an assembly process apparatus achieves excellent productivity with which it is possible to expand or cut line equipments easily according to production volume, and it is possible to achieve utilization of surplus assembly robots.

Growing community of inventors

Toyota, Japan

Masakazu Watanabe