Mitsubishi Electric Corporation

Masakazu Tani

Kazuki Sakata

Yugo Asai

Hiroyuki Higashino

Shigetoshi Ipposhi

Masaru Shinozaki

Yoshiyuki Deguchi

Hiroki Katsube

Shota Yamabe

Matahiko Ikeda

Takuya Nakamura

Hiroki Shiota

Katsushi Nakada

Takao Mitsui

Shuichi Takahama

Yoshitaka Miyaji

Mao Sawakawa

This power conversion device includes: a power module unit; and a capacitor module including a capacitor element, and a capacitor busbar. The capacitor busbar has a flat-plate portion, a plurality of power terminal connection portions, a power supply connection portion, and a plurality of element connection portions. An element-connection-portion position range which is a position range in a first direction between two element connection portions located at both ends, and a power-terminal-connection-portion position range which is a position range in the first direction between two power terminal connection portions located at both ends, are within a position range in the first direction where the flat-plate portion is located. A length of the element-connection-portion position range and a length of the power-terminal-connection-portion position range are equivalent to each other. A center position of the element-connection-portion position range and a center position of the power-terminal-connection-portion position range are equivalent to each other.

Power conversion device

An object is to provide a power conversion device that enables a capacitor element to be efficiently cooled, thus suppressing deterioration of the capacitor element due to heat. The power conversion device includes: a power module including a module body portion storing a semiconductor element, and a power terminal protruding from the module body portion; a capacitor module including a capacitor body portion storing a capacitor element, and a capacitor busbar protruding from the capacitor body portion and connected to the power terminal; and a housing storing the power module and the capacitor module. The housing has a first surface to which the power module is thermally connected, and a second surface to which the capacitor module is thermally connected. A coolant path for cooling the first surface is provided on a back side of the first surface. The capacitor busbar is thermally connected to the first surface.

A manufacturing method for a power module capable of shortening a manufacturing time for a power module is obtained. The manufacturing method for a power module includes: a subassembly arranging step of placing a subassembly including a first electrode, a semiconductor device, and a second electrode on a heat sink via a joining material; and a transfer molding step of, after the subassembly arranging step, under a state in which the first electrode, the semiconductor device, and a second-electrode inner portion are arranged in a region surrounded by the heat sink and a molding die, injecting a thermoplastic resin into the region, wherein, in the transfer molding step, the subassembly is joined to the heat sink via the joining material with use of the resin.

Power module with electrodes and heat sink and manufacturing method therefor

A semiconductor power module is configured in such a way that a protruding portion of a heat sink is inserted into a penetration hole of a jacket, that an end face portion of the protruding portion and a cooling fin are exposed in a flow path, that a front-end portion of the cooling fin abuts on an inner wall surface of the flow path, that a packing is mounted in a groove portion formed between an inner wall portion of the penetration hole and a side wall portion, of the protruding portion of the heat sink, that faces the inner wall portion, that the inner wall portion of the penetration hole and the side wall portion of the protruding portion press the packing in the radial direction thereof, that a spring member presses the front-end portion of the cooling fin to the inner wall surface of the flow path.

Semiconductor power module

It provides an operation part calculating an energy recovered by the heat exchanger in the heat exchanger and energies consumed by the air blower for absorption and the air blower for discharge and determining which of the energy recovered by the heat exchange and the energies consumed by the air blower for absorption and the air blower for discharge is greater, and a control part controlling at least one of the air blower for absorption and the air blower for discharge so that the energy consumed by the air blower for absorption and the air blower for discharge becomes small when the operation part determines that the energy consumed by the air blower for absorption and the air blower for discharge is greater than the energy recovered by the heat exchanger.

Heat exchange system for vehicle and air conditioning system for vehicle

An object of the present disclosure is to suppress variation in currents flowing through semiconductor elements and thereby to achieve size reduction of the semiconductor elements. The semiconductor power module includes electrode terminals for connecting a first electrode to a first external electric component, a second electrode joined to upper surfaces of a plurality of semiconductor elements, and a second electrode extension portion for connecting the second electrode to a second external electric component. The sum of a current path length from the electrode terminal to the semiconductor element in the first electrode and a current path length from the semiconductor element to a second electrode terminal portion in the second electrode, is set to be the same among the plurality of semiconductor elements.

Semiconductor power module with temperature sensors and shaped top plate to equalize current paths

In the application, since the flow of air outside the vehicle compartment flowing through the upstream heat exchange part and the flow of air outside the vehicle compartment flowing through the downstream heat exchange part are opposite flows, a second heat exchanger through which the air outside the vehicle compartment flowing from the first fan through the downstream heat exchange part flows, a first heat exchanger is an orthogonal heat exchanger, the second heat exchanger that is a component of a refrigeration cycle execution system, the air in the vehicle compartment, which flows in from the inside air inlet by the rotation of the second fan and is discharged from the outlet outside the vehicle through the first heat exchanger, and the air outside the vehicle compartment, are exchanged with the first heat exchanger, it can be miniaturized along with the improvement of electricity cost.

Air conditioning equipment for vehicle

The semiconductor device includes: a semiconductor module including a plate-shaped semiconductor element, a conductor electrically connected to one surface of the semiconductor element, a heat dissipation plate of which one surface is thermally and electrically connected to another surface of the semiconductor element, a resin member sealing the semiconductor element, the conductor, and the heat dissipation plate, and an insulation heat dissipation member thermally connected to another surface of the heat dissipation plate exposed from the resin member; a heatsink thermally connected to the insulation heat dissipation member; and an electric field inhibiting plate including a plate-shaped thin part covering the one surface of the semiconductor element and opposed thereto so as to be separated therefrom, the thin part being sealed by the resin member, and a connection part extending from the thin part to the heatsink and thermally and electrically connected to the heatsink.

Semiconductor device

Provided is a semiconductor power module including: a first electrode on which a plurality of element arrays each including a plurality of semiconductor elements arranged in an X direction, are arranged in a Y direction; a first main wiring connected to the respective element arrays mounted on the first electrode; a first sensor mounted on a first detection target element as one of the semiconductor elements, which is least influenced by synthetic inductance of the first main wiring among the semiconductor elements of the plurality of element arrays mounted on the first electrode; a first control terminal disposed on the first electrode; and a control board configured to control a current flowing through the first detection target element based on a detection result of the first sensor obtained via the first control terminal.

A cooler configured to cool an electronic device includes: a refrigerant inlet portion configured to guide refrigerant from an outside of a casing to an inside of the casing; a refrigerant outlet portion configured to guide the refrigerant from the inside of the casing to the outside of the casing; and a metal member located inside the casing and configured to define a flow path region in which the refrigerant is caused to flow from the refrigerant inlet portion to the refrigerant outlet portion. The metal member includes: a plurality of opening portions configured to cause the refrigerant to pass therethrough; and a capture and reduction portion having such a shape as to capture air bubbles, which are generated through a connection surface between the casing and the electronic device. The air bubbles are reduced through cooling by the refrigerant when the electronic device is cooled.

Cooler, power conversion apparatus, and cooling system

A plurality of semiconductor elements have sources which are commonly connected, and drains which are commonly connected. A voltage measurement unit measures an ON voltage between the source of a first semiconductor element of the plurality of semiconductor elements and the drain of the first semiconductor element. A determination unit receives information indicating a magnitude of an ON current between the source of the first semiconductor element and the drain of the first semiconductor element, and a measured value of the ON voltage in the voltage measurement unit, and determines whether the plurality of semiconductor elements are in a normal state or in an overheated state based on the measured value of the ON voltage and the received information indicating the magnitude of the ON current.

Overheat protection control device and vehicle-mounted power circuit device

In a power converting device, an anode lead plate and a cathode lead plate are disposed opposed in an interior of an insulating plate, whereby the respective current directions are opposed and a magnetic field is negated, because of which inductance is reduced. Also, as external connection terminals, which are end portions of the anode lead plate and the cathode lead plate, pass through the interior of the insulating plate and are disposed in another space of the case from a lower portion of the insulating plate, the wiring distance between a capacitor element and a power semiconductor module is short, and inductance can be reduced.

Power converting device

A semiconductor module is provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode. The conductive member is made up of a metal sheet, and has a bent portion at the one end and at the other end. The bent portion provided at the one end has a cut in a leading end portion, in the longitudinal direction, and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element. As a result, a semiconductor module can be realized that allows combination of increased current capacity with improved reliability.

Semiconductor module and conductive member for semiconductor module including cut in bent portion

Provided is a cooling device, a power conversion device, and a cooling system in which bubbles produced by boiling in the cooling device are inhibited from flowing out of the cooling device, and thus, vibration, noise, and damage to pipes and other components can be prevented. A cooling device according to the present invention includes a housing having a hollow interior, the housing having a refrigerant inlet from which refrigerant flows in and a refrigerant outlet from which the refrigerant flows out, and having, in the hollow interior, a refrigerant flow path through which the refrigerant flows, and an opening body provided in the housing, dividing the refrigerant flow path into a first area including a heating surface being at least one of a bottom surface and side surfaces of the housing and heating the refrigerant, and a second area including the refrigerant outlet, and having a plurality of openings.

Cooling device, power conversion device, and cooling system

In the semiconductor module according to the present invention, a conducting member which is used to electrically connect a semiconductor element arranged on a substrate or a bus bar with another electronic component is provided with a structure having flexibility capable of, in a junction with the semiconductor element, reducing the thermal stress due to difference in a coefficient of linear expansion between the conducting member and the semiconductor element, and absorbing dimensional error in objects to be connected. Therefore, the semiconductor module achieves both increased current capacity of the semiconductor device and improved reliability of the semiconductor module.

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Tokyo, Japan

Masakazu Tani