Hitachi, Ltd.

Renesas Technology Corp.

Masakazu Sakaue

Yasuhiro Uemura

Akira Yamagiwa

Ryoichi Kurihara

Takashi Maruyama

Mikihiro Tanaka

Hiroshi Ito

Yuzo Hiroshige

Masashi Miyauchi

Nobuaki Ejima

In the case of providing a new information apparatus purchased for the replacement of or for the use in addition to a currently used information apparatus, the present invention enables a user to use the new information apparatus immediately after the delivery by providing the user with the new information apparatus in such a state that the setups and/or data of the currently used information apparatus are stored therein. The new information apparatus is delivered in the aforementioned state by: receiving from the user an order of a service for transferring setups, data and the like at the same time with receiving an order of the new information apparatus; transmitting from the user to an administrative information apparatus the setups, data and the like to be transferred by using a setups/data transfer-dedicated tool; and transmitting and setting up the contents transmitted to the administrative information apparatus to the new information apparatus to be produced according to the user's order. Thus, the user can operate the new information apparatus in the same environment as that of the currently used information apparatus when the user obtains the new information apparatus.

Method for providing information apparatus together with setups transfer service

Disclosed herein is an improved logic module used for logic emulation along with an enhanced logic emulation board subject to logic verification. The logic module has a plurality of programmable LSIs capable of programming logic and a plurality of switching LSIs capable of programming connections, the LSIs being mounted on one or both sides of a board. Peripheral portions of the board carry connectors for electrical connection to the outside. There are two types of data lines: those directly coupling the connectors to the programmable LSIs, and those linking the connectors to the programmable LSIs via the switching LSIs. The programmable and switching LSIs constitute a crossbar connection arrangement. The logic emulation board has connectors for connection to a logic emulation module, and lands for supporting LSIs targeted for development. Pins of the connectors and the lands are interconnected on a one-to-one basis. Also disclosed here is an upgraded module structure permitting a multiple-stage module setup together with an advanced cooling structure for modules.

Logic emulation module and logic emulation board

The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a high heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector to be electrically connected to the outside, a system control circuit for controlling transfer of a signal between the processor and the connector, and a printed board on which the processor, the connector and the system control circuit are mounted. The CPU module further provides a heat release plate one side of which is pasted with the printed board and the other side of which is substantially planar. The printed board has a cavity formed therein so that the processor may be fitted in the cavity in a bare-chip state. One side of the bare chip is jointed with the heat release plate.

Circuit module and information processing apparatus

The present invention provides an information processing apparatus that may be designed in small and thin size and a small and thin CPU module that has a nigh heat releasing effect and is suitable therefor. The CPU module includes a processor, a connector to be electrically connected to the outside, a system control circuit for controlling transfer of a signal between the processor and the connector, and a printed board on which the processor, the connector and the system control circuit are mounted. The CPU module further provides a heat release plate one side of which is pasted with the printed board and the other side of which is substantially planar. The printed board has a cavity formed therein so that the processor may be fitted in the cavity in a bare-chip state. One side of the bare chip is jointed with the heat release plate.

A packaging method of an electronic component for packaging the electronic component to a packaging substrate comprises the steps of: forming a predetermined quantity of solder bumps at connection portions of the electronic component; forming through-holes and pads on the packaging substrate in such a manner as to correspond to the solder bumps; applying a solder paste to pad portions of the through-holes and the pads formed on the surface of the packaging substrate in such a manner as to attain a specific quantity of solder components with the predetermined quantity of the solder bump; and heating the electronic component and the packaging substrate to a predetermined temperature such that button-shaped connection bumps having a predetermined height are formed between the pads and the packaging substrate so as to connect the electronic component and the packaging substrate and to keep a predetermined gap between the electronic component and the packaging substrate, and cylindrical-post connection bumps are formed between the through-holes and the packaging substrate in accordance with this predetermined gap so as to connect the electronic component and the packaging substrate. In this way, the cylindrical-post connection bumps are formed in association with the button-shaped connection bumps.

Growing community of inventors

Atsugi, Japan

Masakazu Sakaue