Nichia Corporation

Laser Systems Inc.

Masakazu Sakamoto

Masaaki Katsumata

Tomohisa Kishimoto

Yoshiki Sato

Yasuo Kato

Hiroto Tamaki

Yosuke Noda

Kenji Suzuki

Kock Khuen Seet

Masayuki Hayashida

A method for manufacturing a circuit board includes: providing a first board including a post portion, and a second board defining an opening portion extending through a base material, the base material including a circuit pattern disposed on a first surface and an adhesive member disposed on a side of a second surface; and bonding the first board and the second board using the adhesive member by pressurizing and heating the first board and the second board in a state of the post portion being inserted in the opening portion and a top surface of the post portion being exposed from the second board. In a plan view, the second board includes a base material exposed portion. In the bonding, the adhesive member melted by the pressurizing and the heating is disposed between a lateral surface of the post portion and the second board.

Circuit board with convex shaped post, light emitting device, and manufacturing method therefor

A printed circuit board includes a printed wiring board including an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. A semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. Conductive members filled in the through-holes connect the element terminals and the wiring. The insulative substrate has elasticity in which an elongation percentage of the insulative substrate is 20% or more. The wiring is formed from a conductive polymer or an elastic conductive paste in which conductive particles are mixed into a resin material.

Printed circuit board

A method for manufacturing a circuit board includes: preparing a first substrate and a second substrate, wherein: the first substrate comprises a convex post member formed at a top surface of the first substrate, and the second substrate including a first surface and a second surface opposite to the first surface, and comprising: a first metal layer formed on at least the first surface, and an opening through which a top surface of the post member is uncovered in a plan view; bonding at least a portion of a top surface of the first substrate excluding the post member and the second surface of the second substrate so that the top surface of the post member is uncovered through the opening; and forming a circuit pattern by removing a first portion of the first metal layer.

Circuit board, light emitting device, and manufacturing method thereof

A printed circuit board includes a printed wiring board, a semiconductor element, and conductive members. The printed wiring board includes an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. The semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. The conductive members filled in the through-holes connect the element terminals and the wiring.

Printed circuit board and method of manufacturing the same

A method of mounting semiconductor elements, including stretching a stretchable film against an elastic force into a stretched state and disposing a plurality of semiconductor elements in predetermined regions on the stretchable film in the stretched state. Each of the predetermined regions have a predetermined group of semiconductor elements spaced apart from one other at a first distance. The stretchable film is released from the stretched state by using the elastic force of the stretchable film. The first distance between adjacent semiconductor elements in each of the predetermined regions at the time of disposing the semiconductor elements on the stretchable film in the stretched state is reduced to a predetermined second distance of a predetermined mounting distance after releasing the stretchable film from the stretched state.

Method of mounting semiconductor elements and method of manufacturing semiconductor device using a stretched film

A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

Manufacturing method of processed resin substrate and laser processing apparatus

A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.

Method of manufacturing the printed board

A method for manufacturing a printed board includes steps of; providing a starting board comprising a base member having a plate-like shape, having an upper surface and a lower surface opposite the upper surface, and having an insulation property, a first metal layer disposed on the upper surface, and a second metal layer disposed on the lower surface; and laser machining a through-hole penetrating the starting board in a thickness direction of the starting board by irradiating a laser beam irradiation area of the starting board with a laser beam from a side of the starting board on which side the first metal layer is disposed. The method further includes a step of etching the second metal layer so as to remove a portion of the second metal layer located in the laser beam irradiation area, prior to the step of laser machining.

Printed board, light emitting device, and method for manufacturing same

A printed board includes: a plate-shaped base member having an upper surface and a lower surface opposite the upper surface and having an insulation property; a first metal layer disposed on the upper surface; and a second metal layer disposed on the lower surface. The base member has a through-hole penetrating the base member in a thickness direction thereof. The second metal layer is spaced apart from the through-hole by a predetermined distance in a bottom view. The printed board may further include a third metal layer that continuously covers the first metal layer, the second metal layer, and an inner surface of the through-hole. A light emitting device includes the printed board and a light emitting element mounted on the printed board such as to be electrically connected with a wiring pattern composed of the first metal layer, the second metal layer, and the third metal layer.

Printed board and light emitting device

A method of manufacturing a printed board includes perforating a metal foil with a laser beam or punching to provide a through-hole extending in a thickness direction along a thickness of the printed board. An insulating layer is provided. The metal foil having the through-hole is provided on the insulating layer in the thickness direction. An adhesive is provided between the insulating layer and the metal foil having the through-hole. The metal foil is pressed toward the insulating layer to bond the metal foil to the insulating layer via the adhesive. A mask is provided on the metal foil in the thickness direction to cover at least a part of the through-hole without covering an exposed part of the metal foil. The exposed part of the metal foil is etched to provide a wiring pattern on the insulating layer.

Printed board, light source device, semiconductor device, and methods of manufacturing same

A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof; and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 &#x3bc;m to 0.5 &#x3bc;m.

Growing community of inventors

Tokushima, Japan

Masakazu Sakamoto