Mitsubishi Denki Kabushiki Kaisha

Masakazu Murayama

Hiroyuki Nakajima

Fumiyuki Miyamoto

Eiki Jidai

Seiji Oka

Ken Kimura

Yasuko Ohno

Eiki Zidai

A thermosetting insulating resin paste including 100 parts by weight of an epoxy resin containing a diglycidyl type liquid epoxy resin as a main component and based on the parts by weight of the epoxy resin, 0.5 to 10 parts by weight of dicyandiamide as a setting agent. It further contains 1 to 15 parts by weight of a phenoxy resin, 0.1 to 8 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole and/or 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator as well as 50 to 200 parts by weight of a thermally conductive filler. This insulating resin paste exhibits a long pot life and can be set in a short time at a low temperature without generating any voids during the setting, so that it enables the die bonding process in the production of semiconductor devices to be performed as part of the production line. It also allows a smaller device to be used in this process.

Thermosetting insulating resin paste

An epoxy impregnating resin composition comprising 100 parts by weight of a compound having at least two epoxy groups in one molecule, from 0.1 to 100 parts by weight of an allyl epoxy compound having both allyl and epoxy groups in one molecule and represented by the general formula: ##STR1## where R is hydrogen, halogen or a monovalent organic group, from 30 to 300 parts by weight of a liquid cyclic acid anhydride, and from 5 to 300 parts by weight of a compound having a polymerizable double bond.

Epoxy impregnating resin composition

A thermosetting resin composition, consists essentially of:

Thermosetting resin composition

A thermosetting resin composition, which is characterized by mixing 5 to 300 parts by weight of tri-functional vinyl monomer and 0.1 to 10 parts by weight of phenoxy resin with respect to 100 parts by weight in total of an epoxy compound containing in its molecule at least two epoxy groups and a curing agent for said epoxy compound.

Growing community of inventors

Takatsuki, Japan

Masakazu Murayama