Fujitsu Component Limited

Masakazu Muranaga

Shinya Yamamoto

Tatsuya Kakehashi

Tohru Muramatsu

Kimihiro Maruyama

Toshiya Koyama

Takeshi Wakui

Masaru Sakurai

A wireless module including: a substrate that includes a first surface and a second surface on the back side of the first surface; a plurality of signal terminals that are provided on the first surface and the second surface, input and output signals; an antenna provided on the first surface; a signal processing circuit that is provided on the second surface, is connected between the signal terminals and the antenna, and performs various signal processings on signals input from the signal terminals and the antenna; wherein the signal terminals are arranged in horizontal symmetry on the first surface and the second surface, arranged at the same positions of the first surface and the second surface, and connected to a single signal line in the substrate.

Wireless module

An electronic component module includes a board having an electronic component mounted on a surface of the board and a shield case mounted on the surface of the board and covering the electronic component. The board includes a projecting part projecting from the surface of the board. The projecting part is formed of plating at a position along a sidewall of the shield case and is soldered to the shield case.

Electronic component module, board, and method of manufacturing electronic component module

A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.

Module board

An electronic device includes a first substrate including a first electrode formed on a surface of the first substrate, an electronic component mounted on another surface of the first substrate, a second substrate placed on the first substrate via the electronic component, and a shield disposed between the first substrate and the second substrate.

Growing community of inventors

Tokyo, Japan

Masakazu Muranaga