Fuji Polymer Industries Co., Ltd.

Nec Corporation

Masakazu Koizumi

Jinya Tanaka

Junya Sato

Yoshiyuki Hashimoto

Toshiki Ogawa

A conductive rubber component () of the present invention includes a metal coating () formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body () by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting a conductive rubber component () of the present invention, the conductive rubber component () is surface mounted on a wiring layer () on a printed wiring board () and is fixed by a solder layer () thereto and thereby is incorporated to electrically connect the printed circuit board () and an electronic component () to each other. Thus, a conductive rubber component and a method for mounting same are provided, wherein the conductive rubber component is used as an electrical contact of an electronic component compatible with the surface mount technology (SMT), the conductive rubber component does not cause any damage to the electrode surface of the electronic component even when the body of an electronic device in which it is mounted is distorted or warped, it has lower resistance and excellent chemical stability and can be used for SMT.

Conductive rubber component and method for mounting same

A conductive rubber component includes a laminate in which conductive rubber layers and insulating rubber layers are laminated alternately in parallel, and the conductive rubber layers and the insulating rubber layers are integrated at their boundaries by a cross-linking reaction. A solderable metal coating is integrated with at least one surface of the laminate that is perpendicular to the electrical conduction direction by the deposition of at least one selected from atoms and molecules. This conductive rubber component can have good compression load properties and good compression set properties, achieve a stable electric connection for a long period of time due to the good compression set properties, be soldered to a printed wiring board or the like because of the presence of the integrated metal coating, suppress the occurrence of burrs, reduce costs, and improve the production efficiency.

Conductive rubber component

A metal-integral conductive rubber component () of the present invention includes a laminate in which conductive rubber layers () and insulating rubber layers () are laminated alternately in parallel. The conductive rubber layers () and the insulating rubber layers () are integrated at their boundaries by cross-linking between the conductive rubber layers and the insulating rubber layers. The volume resistivity of the conductive rubber layers () is 10&#x3a9;&#xb7;cm or more and 10 K &#x3a9;&#xb7;cm or less. The volume resistively of the insulating rubber layers () is 1 M &#x3a9;&#xb7;cm or more and 10&#x3a9;&#xb7;cm or less. A metal plate is integrated with at least one surface of the laminate that is perpendicular to the electric conduction direction via a conductive adhesive layer () made of conductive rubber. With this configuration, the metal-integral conductive rubber component can have high compression set properties, achieve a stable electric connection over a long period of time, be bonded to a printed wiring board, reduce in cost, and improve the production efficiency.

Metal-integral conductive rubber component

A circuit board device comprises a first wiring board () having plural first electrode terminals () for connection row-arranged on a surface layer, a second wiring board () having plural second electrode terminals () for connection row-arranged on a surface layer, and an anisotropic conductive member () disposed therebetween to the electrode terminals (). A local portion of each of the wiring boards () has a step difference to divide and dispose the electrode terminals (). A local portion of the anisotropic conductive member () corresponding to the step difference has a step shape that is capable of contacting with the step difference. A laminate comprising respective wiring boards () and the anisotropic conductive member disposed therebetween is pressed and held in a lamination direction.

Growing community of inventors

Aichi, Japan

Masakazu Koizumi